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Related publications (26)

Rapidly verifiable aggregate signatures

Rachid Guerraoui, Matteo Monti, Manuel José Ribeiro Vidigueira, Martina Camaioni, Gauthier Jérôme Timothée Voron, Pierre-Louis Blaise Roman

A method for aggregating digital signatures comprises the following steps carried out by a signature aggregator: receiving first data packages from signers, each first data package comprising a signer identifier, a payload, and a payload signature; verifyi ...

2024

Dataset for "Complexity of crack front geometry enhances toughness of brittle solids"

John Martin Kolinski, Chenzhuo Li, Xinyue Wei

This data package supports the publication 'Complexity of crack front geometry enhances toughness of brittle solids' by Xinyue Wei, Chenzhuo Li, Cían McCarthy, and John M. Kolinski Nature physics (2024) - https://doi.org/10.1038/s41567-024-02435-x DOI: 1 ...

Zenodo2024

Tunable biocomposite films fabricated using cellulose nanocrystals and additives for food packaging

Cong Chen, Wenjing Sun

Cellulose nanocrystals (CNCs) are considered a prospective packaging material to partially replace petroleumbased plastics attributed to their renewability, sustainability, biodegradability, and desirable attributes including transparency, oxygen, and oil ...

ELSEVIER SCI LTD2023

Lignin, from biomass waste to sustainable materials for food packaging, antiviral coatings and agriculture

Alice Boarino

Our planet has been challenged for years by our reckless use of fossil fuels, which has led to the ongoing climate change and energy crisis. The transition to the use of renewable alternative sources has now became urgent and inevitable. The valorization o ...

EPFL2023

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Dataset for the paper High durability and stability of 2D nanofluidic devices for long-term single-molecule sensing

Andras Kis, Aleksandra Radenovic, Martina Lihter, Yanfei Zhao, Michal Daniel Macha, Mukeshchand Thakur, Andrey Chernev, Mukesh Kumar Tripathi, Nianduo Cai, Miao Zhang, Yunfei Teng

Information regarding the Dataset, corresponding to the paper: “Thakur, M., Cai, N., Zhang, M. et al. High durability and stability of 2D nanofluidic devices for long-term single-molecule sensing. npj 2D Mater Appl 7, 11 (2023). https://doi.org/10.1038/s41 ...

Zenodo2023

Linear and nonlinear applications of miniaturized silicon nitride microresonators

Arslan Sajid Raja

Photonic integrated circuits (PICs) are the subject of massive interest due to the range of applications they can provide at a huge scale while building on well-established CMOS technologies. One of the critical parameters defining a technology's maturity ...

EPFL2023

Electrospun zein incorporating phycocyanin and Spirulina extract: Fabrication, characterization, and potential application

Niloufar Sharif

Electrospinning was used to develop zein fibers containing phycocyanin and aqueous-ethanolic extract of Spirulina (AEES) for elucidating the potent packaging properties of phycocyanin and AEES on walnut samples. Morphological results revealed that using th ...

Elsevier2023

Decarbonizing The Production of Primary Aluminium Using Renewable Resource

Aluminium is the second most widely used metal in the world, with a variety of applications ranging from transportation to food packaging and construction. While many aluminium producers target increased utilization of recycled aluminium to produce rolled ...

American Institute of Chemical Engineering2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Method for labelling a device and devices obtanaible therefrom

Ludovic Serex, Nicolas Vachicouras, Florian Dylan Fallegger

Disclosed herein is a method for labelling a portion of a device, said method comprising the steps of providing a first substrate layer of a transparent or translucent material, depositing a first coloured material onto said first substrate layer in a labe ...

2022

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Göran Stemme, Hamed Sattari, Alain Yuji Takabayashi

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

The Scikit HEP Project - overview and prospects

Matthieu Philippe Luther Marinangeli, Pratyush Das

Scikit-HEP is a community-driven and community-oriented project with the goal of providing an ecosystem for particle physics data analysis in Python. Scikit-HEP is a toolset of approximately twenty packages and a few "a ffiliated" packages. It expands the ...

E D P SCIENCES2020

ROS-Neuro: A common middleware for BMI and robotics. The acquisition and recorder packages

José del Rocio Millán Ruiz, Luca Tonin, Stefano Tortora

Recent advances in the Brain-Machine Interface (BMI) and in the robotic fields allowed researchers to design a new generation of brain-actuated neuroprostheses to control a variety of assistive devices-ranging from powered wheelchairs to telepresence robot ...

IEEE2019

Organic-Inorganic Hybrid Planarization and Water Vapor Barrier Coatings on Cellulose Nanofibrils Substrates

Yves Leterrier, Feyza Karasu Kiliç

Cellulose nanofibrils (CNF) can be produced in the form of thin, transparent and flexible films. However, the permeability of such materials to oxygen and water vapor is very sensitive to moisture, which limits their potential for a variety of packaging an ...

2018

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Aïcha Hessler-Wyser, Thierry Hessler, Michel Rappaz, Léa Deillon

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

Non-contact sub-nanometer optical repositioning using femtosecond lasers

Yves Bellouard

Optical components like resonator or waveguides often have stringent requirements in term of positioning accuracy during packaging. While this can be done routinely in a laboratory environment, permanently positioning and aligning optical elements with nan ...

Optical Society of America2015

Implantable Multi-panel Platform for Continuous Monitoring of Exogenous and Endogenous Metabolites for Applications in Personalized Medicine

Camilla Baj-Rossi

Nowadays, scientific advances are leading to the discovery of newer, better, more targeted treatments that will improve the human health. However, despite the promising results and the major advantages in treatments offered to patients, these personalized ...

EPFL2015

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Yves Pétremand, Danick Briand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

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