The emerging three-dimensional (3D) integration technology is expected to lead to an industry paradigm shift due to its tremendous benefits. Intense research activities are going on about technology, simulation, design, and product prototypes. This thesis ...
This paper presents the hardware realization and modeling of high-density microelectrode arrays including both microelectronic readout amplifiers as well as three-dimensional microelectrodes forming a fully integrated CMOS compatible system enabling resear ...
Optical trapping, discovered in the 70's, allows moving and stabilizing small objects which sizes varies from atoms to particles of several microns. This technique, based on momentum conservation, is particularly well suited for manipulating biological mat ...
Current Systems-On-Chip (SoC) execute applications that demand extensive parallel processing; thus, the amount of processors, memories and application-specific signal pro- cessing cores is rapidly increasing. In these new Multi- Processor SoCs, (MPSoCs) on ...
Instruction-cache misses account for up to 40%; of execution time in online transaction processing (OLTP) database workloads. In contrast to data cache misses, instruction misses cannot be overlapped with out-of-order execution. Chip design limitations do ...
Current Systems-On-Chip execute applications that demand extensive parallel processing. Networks-On-Chip (NoC) provide a structured way of realizing interconnections on silicon, and obviate the limitations of bus-based solutions. NoCs can have regular or a ...
