Publications related to Fab lab

Additively manufactured stretchable zipping electrostatic actuators

The use of soft and stretchable materials allows the development of adaptive robotic systems and human-machine interfaces that are more natural and comfortable to interact with. One of the application fields that benefits the most from these compliant mate ...

EPFL2024

Volumetric additive manufacturing in a scattering resin

Jorge Andres Madrid Wolff

Volumetric 3D printing is a novel technique that offers promising new perspectives in tissue engineering. In volumetric 3D printing, photosensitive gels or liquids are solidified by projecting light patterns via reverse tomography. Recent results show that ...

EPFL2023

A multi-material robotic finger with integrated proprioceptive and tactile capabilities produced with a circular process

Josephine Anna Eleanor Hughes, Kai Christian Junge, Antonia Georgopoulou Papadonikolaki

When developing or designing biomimetic robotic fingers with rigid and soft components and integrated sensors, fabrication is often a bottle-neck when assembling and casting processing techniques are used. This study introduces a thermoplastic multi-materi ...

IEEE2023

First developments towards producing inductive magnetic sensors using state-of-the-art photolithography techniques

Duccio Testa, Marcus Cemes, Ambrine Douhane

Inductive magnetic sensors are needed for tokamak operation to provide the low-frequency (LF) measurements leading to the equilibrium reconstruction and to monitor the higher frequency (HF) instabilities; the HF magnetic sensors are often also used as a ba ...

2023

Additive and digital manufacturing of transient sensors and bioelectronics

Nicolas Francis Fumeaux

Transient electronics have emerged as a promising class of devices, capable of breaking down without harmful side effects to their environment. They have tremendous potential as bioresorbable electronics for temporary applications in the human body, and as ...

EPFL2023

Zinc hybrid sintering for printed transient sensors and wireless electronics

Danick Briand, Nicolas Francis Fumeaux

Transient electronics offer a promising solution for reducing electronic waste and for use in implantable bioelectronics, yet their fabrication remains challenging. We report on a scalable method that synergistically combines chemical and photonic mechanis ...

2023

Discrete Voss surfaces: Designing geodesic gridshells with planar cladding panels

Corentin Jean Dominique Fivet, Nicolas Robin Montagne, Olivier Baverel

The design and construction of doubly-curved structures often reveals to be challenging and can result in complex manufacturing and assembly. A recent strategy to tackle this difficulty consists in exploiting the connection between discrete differential ge ...

2022

Scalable fabrication of functional nanostructures on stretchable substrates by capillary-assisted particle assembly and adhesion lithography

Henry Shao-Chi Yu

The fabrication of metallic nanostructures on stretchable substrates enables specific applications that exploit the combination of the nano-scale phenomena and the mechanical tunability of the physical dimensions of the nanostructures. Due to the large dif ...

EPFL2022

Doping challenges and pathways to industrial scalability of III–V nanowire arrays

Anna Fontcuberta i Morral, Lucas Güniat, Valerio Piazza, Wonjong Kim

Semiconductor nanowires (NWs) have been investigated for decades, but their application into commercial products is still difficult to achieve, with triggering causes related to the fabrication cost and structure complexity. Dopant control at the nanoscale ...

2021

Fabrication of zipping electrostatic actuators incorporating inkjet-printed layers

Herbert Shea, Samuel Rosset, Giulio Grasso

Zipping electrostatic actuators operate by bending flexible electrodes using electrostatic forces. This principle allows the use of a wide range of dielectric and conductive materials. Additive Manufacturing (AM) techniques can be used to fabricate these a ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Fabrication of Single-Crystalline InSb-on-Insulator by Rapid Melt Growth

Anna Fontcuberta i Morral, Nicholas Paul Morgan, Heera Menon

InSb has the smallest bandgap and highest electron mobility among III-V semiconductors and is widely used for photodetectors and high-frequency electronic applications. Integration of InSb directly on Si would drastically reduce the fabrication cost and en ...

Wiley2021

Fabrication of Sub-10-nm Plasmonic Gaps for Ultra-Sensitive Raman Spectroscopy

Hatice Altug, Arif Engin Cetin

The past two decades have witnessed the explosion of activities in the field of surface enhanced Raman spectroscopy (SERS). SERS platforms employ nano-structures that excite plasmonic modes with large local electromagnetic fields localized within small gap ...

SPRINGER2020

A Structural Design Methodology for Freeform Timber Plate Structures Using Wood-Wood Connections

Anh Chi Nguyen

Over the past decades, timber has gained popularity as a sustainable building material because of the rising environmental awareness. Furthermore, the resurgence of timber has also been encouraged by the advent of the digital age during the 21st century. T ...

EPFL2020

Thermomechanical Nanocutting of 2D Materials

Jürgen Brugger, Giovanni Boero, Xia Liu, Ana Conde Rubio, Samuel Tobias Howell

Atomically thin materials, such as graphene and transition metal dichalcogenides, are promising candidates for future applications in micro/nanodevices and systems. For most applications, functional nanostructures have to be patterned by lithography. Devel ...

Wiley2020

Large-scale fabrication of flexible solid-state reference electrodes

Hubert Girault, Kumar Varoon Agrawal, Milica Jovic, Luis Francisco Villalobos Vazquez de la Parra

A new approach for large-scale fabrication of miniaturized, reliable and planar solid-state reference electrodes on flexible substrates is presented. Inkjet printing technique was used for the fabrication of conductive path and silver patterns that were ch ...

2019

Computational Design of Auxetic Shells

Mina Konakovic Lukovic

Recent advances in material science and digital fabrication provide promising opportunities for product design, mechanical and biomedical engineering, robotics, architecture, art, and science. Engineered materials and personalized fabrication are revolutio ...

EPFL2019

Photoinitiator-free multi-photon fabrication of compact optical waveguides in polydimethylsiloxane

Demetri Psaltis, Christophe Moser, Ye Pu, Giulia Panusa, Jieping Wang

Compact, low loss flexible optical waveguides are crucial in optofluidic and microfluidic devices for a dense integration of optical functionalities. We demonstrate the fabrication of compact optical waveguides in polydimethylsiloxane through multiphoton l ...

2019

Rapid Deployment of Curved Surfaces via Programmable Auxetics

Mark Pauly, Mina Konakovic Lukovic, Francis Julian Panetta

Deployable structures are physical mechanisms that can easily transition between two or more geometric configurations; such structures enable industrial, scientific, and consumer applications at a wide variety of scales. This paper develops novel deployabl ...

2018

Fabrication of slender elastic shells by the coating of curved surfaces

François Gallaire, Pedro Miguel Nunes Pereira de Almeida Reis, Gioele Mariano Nicolò Balestra, Pierre-Thomas Paul Brun

Various manufacturing techniques exist to produce double-curvature shells, including injection, rotational and blow molding, as well as dip coating. However, these industrial processes are typically geared for mass production and are not directly applicabl ...

Nature Publishing Group2016

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Giovanni De Micheli, Luca Benini

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and l ...

Institute of Electrical and Electronics Engineers2015