Concept

Package on a package

Related lectures (13)

Chip Packaging Process Flow: Major Steps

Covers the major steps in chip packaging and the evolution of packaging technologies.

MEMS Packaging: 3D Integration & Advanced Technologies

Explores advanced MEMS packaging technologies, including 3D integration, hermetic packaging, and wafer-level packaging processes.

Packaging of Intelligent Systems

Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.

Emerging Memory I

Explores the landscape of big data, memory importance in online services, challenges faced by memory systems, emerging DRAM technologies, and storage-class memory.

Advanced MEMS Packaging

Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.

Infrared Photodetectors: Mercury Cadmium Telluride Technology

Covers the technology and applications of Mercury Cadmium Telluride photoconductors in infrared detection systems.

MEMS Resonators and Oscillators

Explores MEMS resonators and oscillators, CMOS integration, frequency stability, temperature drift compensation, resonator packaging, and advanced resonator structures.

Designing Information Systems: Lessons from CompuSys

Explores challenges in designing effective information systems using the case study of CompuSys.

Memory Cache: Storage and Network

Explores cache memory, data organization impact, storage structuring, communication protocols, and packet switching in computer networks.

SSL Certificate Deployment for ENAC Web Hosting

Focuses on SSL certificate deployment for ENAC Web Hosting, covering certificate generation, debugging, and Ansible playbook management.

Reducing Emissions: Cost Analysis and Maximizing Profit

Explores cost analysis to reduce emissions and maximize profit through optimal measures.

Protected Access in Java

Covers the concept of protected access in Java and its implications for class design.

Packaging of Intelligent Systems

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.