Publications related to Package on a package

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Energy Efficient Logic and Memory Design With Beyond-CMOS Magnetoelectric Spin-Orbit (MESO) Technology Toward Ultralow Supply Voltage

Kyojin Choo

Devices based on the spin as the fundamental computing unit provide a promising beyond-complementary metal-oxide-semiconductor (CMOS) device option, thanks to their energy efficiency and compatibility with CMOS. One such option is a magnetoelectric spin-or ...

Ieee-Inst Electrical Electronics Engineers Inc2023

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Rafael Medina Morillas, Joshua Alexander Harrison Klein

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

A Pixel Design of a Branching Ultra-Highspeed Image Sensor

Edoardo Charbon

A burst image sensor named Hanabi, meaning fireworks in Japanese, includes a branching CCD and multiple CMOS readout circuits. The sensor is backside-illuminated with a light/charge guide pipe to minimize the temporal resolution by suppressing the horizont ...

2021

Chip-based soliton microcomb module using a hybrid semiconductor laser

Tobias Kippenberg, Rui Ning Wang, Nicolas Volet, Junqiu Liu, Erwan Guillaume Albert Lucas, Arslan Sajid Raja, Jijun He

Photonic chip-based soliton microcombs have shown rapid progress and have already been used in many system-level applications. There has been substantial progress in realizing soliton microcombs that rely on compact laser sources, culminating in devices th ...

2020

Observation of coupled mechanical resonance modes within suspended 3D nanowire arrays

Yusuf Leblebici, Yasin Kilinc

Complex yet compact nanoscale mechanisms have largely been absent due to the rather limited availability of components and integration techniques. Especially missing have been efficient interconnects with adjustable characteristics. To address this issue, ...

ROYAL SOC CHEMISTRY2020

Genome Sequence Alignment - Design Space Exploration for Optimal Performance and Energy Architectures

David Atienza Alonso, Marina Zapater Sancho, Yasir Mahmood Qureshi, José Manuel Herruzo Ruiz

Next generation workloads, such as genome sequencing, have an astounding impact in the healthcare sector. Sequence alignment, the first step in genome sequencing, has experienced recent breakthroughs, which resulted in next generation sequencing (NGS). As ...

2020

1.55-mu m wavelength wafer-fused OP-VECSELs in flip-chip configuration

Elyahou Kapon, Alexandru Mereuta, Andrei Caliman, Pascal Gallo

Optically-pumped vertical external cavity surface emitting lasers (VECSELs) based on flip-chip gain mirrors emitting at the 1.55-mu m wavelength range are reported. The gain mirrors employ wafer-fused InAlGaAs/InP quantum well heterostructures and GaAs/AlA ...

SPIE-INT SOC OPTICAL ENGINEERING2019

Rapid identification and interpretation of gene‐environment associations using the new R.SamBada landscape genomics pipeline

Stéphane Joost, Oliver Michele Selmoni, Estelle Rochat, Sylvie Stucki, Kevin Leempoel, Elia Vajana, Solange Catherine Gaillard

Samβada is a genome‐environment association (GEA) software, designed to search for signatures of local adaptation. However, pre‐ and post‐processing of data can be labour‐intensive, preventing wider uptake of the method. We have now developed R.SamBada, an ...

2019

Learning-Based Hardware Design for Data Acquisition Systems

Cosimo Aprile

This multidisciplinary research work aims to investigate the optimized information extraction from signals or data volumes and to develop tailored hardware implementations that trade-off the complexity of data acquisition with that of data processing, conc ...

EPFL2018

Progress in single-photon avalanche diode image sensors in standard CMOS: From two-dimensional monolithic to three-dimensional-stacked technology

Edoardo Charbon, Myung Jae Lee

Single-photon detection and photon counting are useful tools in many fields, from light detection and ranging (LiDAR) to biomedical imaging and from time-resolved Raman spectroscopy to quantum applications. In this context, recently, single-photon avalanch ...

IOP PUBLISHING LTD2018

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Mikhail Asiatici, Göran Stemme

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are ch ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2018

An FPGA-Based Test System for RRAM Technology Characterization

Giovanni De Micheli, Pierre-Emmanuel Julien Marc Gaillardon, Maxime Victor Thammasack, Armando Biscontini

Resistive random access memory (RRAM) technologies have recently gained large attention from the academic and industrial research communities. Significant efforts have been made to enhance the performance of the memory stacks from both communities through ...

2018

Experimental characterisation of the thermohydraulic performance of a micro-pin fin evaporator: Heat transfer, flow visualization and modelling

Chiara Falsetti

The global tendency towards miniaturization driven by the microelectronics industry is pushing system density and packaging towards unprecedented values of thermal design power, with a dramatic reduction of the surface area of the devices. Vertical integra ...

EPFL2018

Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications

Mikhail Asiatici, Göran Stemme

Through silicon vias (TSVs) are key enablers of 3-D integration technologies which, by vertically stacking and interconnecting multiple chips, achieve higher performances, lower power, and a smaller footprint. Copper is the most commonly used conductor to ...

Institute of Electrical and Electronics Engineers2017

Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Seniz Esra Küçük

Research and development efforts on chip and wafer-scale 3D integration for system miniaturization have been continuing for more than a decade. However, there are still only a handful of 3D integrated products available in the market due to the high cost a ...

EPFL2017

Magnetization loss for stacks of ReBCO tapes

Pierluigi Bruzzone, Davide Uglietti

The AC loss measurements of the high temperature superconductor (HTS) cable prototype in the EDIPO test facility motivated detailed investigations of the loss contributions from the tape, strand and cable stages of the HTS fusion conductor design proposed ...

2017

A Chip-Level Post-CMOS Via-Last Cu TSV Process for Multi-Layer Homogeneous 3D Integration

Seniz Esra Küçük, Yusuf Leblebici, Woo Yeong Cho

In this paper, a die-level CMOS post-processing scheme for 3D integration using the via-last approach is presented for multi-layer stacking. The process includes TSV fabrication, chip-to-chip bonding, and finally the TSV filling with Cu electroplating. The ...

Ieee2016

Storage method and apparatus for random access memory using codeword storage

Harm Cronie

A memory circuit, such as an embedded DRAM array, stores information as groups of bits or data using information coding in storage and retrieval data, instead of each bit being stored separately. Write data words can be mapped to storage format words that ...

2016

Copper TSV-Based Die-Level Via-Last 3D Integration Process with Parylene-C Adhesive Bonding Technique

Yusuf Leblebici, Seniz Esra Küçük

This paper presents a die-level post-CMOS processing protocol for multi-layer homogeneous 3D integration with adhesive bonding technique using parylene-C as an intermediate bonding layer and sidewall passivation material. This protocol was used to fabricat ...

2016