Lectures related to Through-silicon via

MEMS Packaging: 3D Integration & Advanced Technologies

Explores advanced MEMS packaging technologies, including 3D integration, hermetic packaging, and wafer-level packaging processes.

Silicon Chip Design

Discusses silicon chip design, metal layer layout, shielding layers, and design challenges.

Emerging Memory I

Explores the landscape of big data, memory importance in online services, challenges faced by memory systems, emerging DRAM technologies, and storage-class memory.

Packaging of Intelligent Systems

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.

Distributed Memory

Covers distributed memory systems, cache organization, multi-socket architectures, memory coherence, and on-chip interconnect design.

Heterogeneous Integration: Smart Systems on Foil

Explores the integration of silicon components on polymeric foils for smart systems, covering challenges, techniques, and interconnection methods.

Silicon Wafer Preparation

Explores silicon wafer preparation for photovoltaic devices, covering quality, costs, wafering techniques, mechanical properties, and industry trends.