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Related lectures (4)
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Packaging of Intelligent Systems
Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.
Microcontrollers: Basics and Applications
Covers the basics of microcontrollers, different packaging types, circuit implementation methods, and software tools for circuit design.
Electric Field and Potential: Wire Calculation
Explores the calculation of electric field and potential near a wire.
Navigation Equation: France and ECEF
Explains the navigation equation in arbitrary frames and the relationship between France and ECEF.
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