A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are ch ...
The Locomotive Assignment Problem (LAP) is a class of planning and scheduling problems solved by assigning a fleet of locomotives to a network of trains. In the planning versions of the LAP, the type of consist (a group of linked locomotives) assigned to e ...
Thanks to recent technology related to product monitoring and data communication, it is now possible for a company to gather various kinds of product usage data during its operation in a ubiquitous way. However, the application of the newly gathered data i ...
This paper proposes a voltage support scheme for traction networks, which compensates for the voltage drop along the catenary line to which locomotives are connected. The proposed method is based on the injection of capacitive reactive power through the cu ...
This article presents the modeling, simulation, and practical application of a double-fed asynchronous motor-generator for pumped-storage plants equipped with a three-level VSI cascade. The problem of DC unbalance control is studied in this particular appl ...
