Radiation Hard MicroelectronicsExplores radiation-hard microelectronics design, rad-hard ASIC libraries, and mitigation techniques for single-event effects.
Advanced MEMS PackagingExplores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.
Packaging of Intelligent SystemsExplores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.