Lectures related to Wire bonding

Nanogap Electrodes: Electromigration and Modeling

Explores the synergy between nanomaterial and CMOS electronics for (bio)sensing applications, focusing on the electromigration method for nanogap electrodes.

Chip Packaging Process Flow: Major Steps

Covers the major steps in chip packaging and the evolution of packaging technologies.

Interconnect / Wires

Explores the evolution and importance of interconnect technologies in VLSI design, focusing on wire geometries and capacitance.

Packaging of Intelligent Systems

Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.