Lectures related to Ball grid array

Advanced MEMS Packaging

Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.

Molecular Transistors: Design and Simulation

Explores molecular transistors for logic computation, design, simulation, and fabrication, emphasizing interconnect parasitics and device performance.

Infrared Photodetectors: Mercury Cadmium Telluride Technology

Covers the technology and applications of Mercury Cadmium Telluride photoconductors in infrared detection systems.

Packaging of Intelligent Systems

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.

Palindrome: Assembly Program for Detecting Palindromes

Covers the assembly programming exercise of detecting palindrome binary numbers.

Introduction to NumPy: Part 1

Covers the basics of NumPy, including array construction and manipulation.