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Related lectures (5)
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Packaging of Intelligent Systems
Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.
Advanced MEMS Packaging
Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.
Molecular Transistors: Design and Simulation
Explores molecular transistors for logic computation, design, simulation, and fabrication, emphasizing interconnect parasitics and device performance.
Palindrome: Assembly Program for Detecting Palindromes
Covers the assembly programming exercise of detecting palindrome binary numbers.
Introduction to NumPy: Part 1
Covers the basics of NumPy, including array construction and manipulation.
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