Wafer-level packaging

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Related lectures (9)

Packaging of Intelligent Systems

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.

Chip Packaging Process Flow: Major Steps

Covers the major steps in chip packaging and the evolution of packaging technologies.

MEMS Packaging: 3D Integration & Advanced Technologies

Explores advanced MEMS packaging technologies, including 3D integration, hermetic packaging, and wafer-level packaging processes.

Advanced MEMS Packaging

Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.

MEMS Resonators and Oscillators

Explores MEMS resonators and oscillators, CMOS integration, frequency stability, temperature drift compensation, resonator packaging, and advanced resonator structures.

Josephson Junction Fabrication

Details the fabrication process of Josephson junctions, highlighting reliability and identical characteristics for quantum computation applications.

Packaging of Intelligent Systems

Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.

Semicustom RTL Design: Design Flow and Standard Cells

Explores the RTL design flow, chip-level integration, standard cells, and static timing analysis in VLSI design.

Infrared Photodetectors: Mercury Cadmium Telluride Technology

Covers the technology and applications of Mercury Cadmium Telluride photoconductors in infrared detection systems.

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