Soldering

Related lectures (9)

Covers soldering and brazing fundamentals, eutectic alloys, joint interfaces, fluxes, aluminum brazing challenges, and hybrid metal-ceramic parts.

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.

Focuses on soldering components on a breakout board with precision and avoiding short circuits.

Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.

Introduces assembly techniques, covering joining technology, welding processes, joint functionality, and classification of joints.

Covers the major steps in chip packaging and the evolution of packaging technologies.

Offers a hands-on workshop experience in soldering and circuit building, exploring the maker movement and STEM education.

Covers the integrity of joints, typical defects, failure modes, and metal additive manufacturing techniques.

Explores laser welding, soldering, deep welding, joint geometries, drilling, and cutting techniques.

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