Publications related to System in a package

Eco-Conscious Approach to Wireless Gas Monitoring With a Hybrid Printed Passive Sensor Tag

Sandro Carrara, Johanna Zikulnig, Jürgen Kosel

Addressing the environmental impact of electronic waste in biomedical sensing, an eco-conscious approach to the realization of a Chitosan-based Acetone sensor tag for wireless gas monitoring is presented. The fabrication involves inkjet printing of silver ...

Ieee-Inst Electrical Electronics Engineers Inc2024

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Rafael Medina Morillas, Joshua Alexander Harrison Klein

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Integrated silicon photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi

Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and ...

SPRINGERNATURE2023

Sub-kHz-Linewidth External-Cavity Laser (ECL) With Si3N4 Resonator Used as a Tunable Pump for a Kerr Frequency Comb

Tobias Kippenberg, Junqiu Liu

Combining optical gain in direct-bandgap III-V materials with tunable optical feedback offered by advanced photonic integrated circuits is key to chip-scale external-cavity lasers (ECL), offering wideband tunability along with low optical linewidths. Exter ...

IEEE Institute of Electrical and Electronics Engineers2023

AstriFlash: A Flash-Based System for Online Services

Babak Falsafi, Siddharth Gupta, Lei Yan, Mark Johnathon Sutherland, Yunho Oh

Modern datacenters host datasets in DRAM to offer large-scale online services with tight tail-latency requirements. Unfortunately, as DRAM is expensive and increasingly difficult to scale, datacenter operators are forced to consider denser storage technolo ...

2023

Thermal and Power-Aware Run-Time Performance Management of 3D MPSoCs with Integrated Flow Cell Arrays

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse, Halima Najibi

Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurrently provide cooling and power generation to integrated circuits (ICs). This solution is particularly appealing for Three-Dimensional Multi-Processor Syste ...

2022

Thermal and Voltage-Aware Performance Management of 3D MPSoCs with Flow Cell Arrays and Integrated SC Converters

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Alexandre Sébastien Julien Levisse, Halima Najibi

Flow cell arrays (FCAs) concurrently provide efficient on-chip liquid cooling and electrochemical power generation. This technology is especially promising for three-dimensional multi-processor systems-on-chip (3D MPSoCs) realized in deeply scaled technolo ...

2022

Design and management of three-dimensional multi-processor systems-on-chip with integrated flow cell arrays

Halima Najibi

Three-Dimensional Multi-Processor Systems-on-Chip (3D MPSoCs) are promising solutions for highly intensive Artificial Intelligence (AI) and Big Data applications. They combine remarkably dense computation capabilities and massive communication bandwidths. ...

EPFL2022

A novel approach for SPICE modeling of light and radiation effects in ICs

Chiara Rossi

Modeling the interaction of ionizing radiation, either light or ions, in integrated circuits is essential for the development and optimization of optoelectronic devices and of radiation-tolerant circuits. Whereas for optical sensors photogenerated carriers ...

EPFL2021

Characterization and Analysis of On-Chip Microwave Passive Components at Cryogenic Temperatures

Edoardo Charbon, Andrea Ruffino, Fabio Sebastiano

This paper presents the characterization and modeling of microwave passive components in TSMC 40-nm bulk CMOS, including metal-oxide-metal (MoM) capacitors, transformers, and resonators, at deep cryogenic temperatures (4.2 K). To extract the parameters of ...

2020

Chip-based soliton microcomb module using a hybrid semiconductor laser

Tobias Kippenberg, Rui Ning Wang, Nicolas Volet, Junqiu Liu, Erwan Guillaume Albert Lucas, Arslan Sajid Raja, Jijun He

Photonic chip-based soliton microcombs have shown rapid progress and have already been used in many system-level applications. There has been substantial progress in realizing soliton microcombs that rely on compact laser sources, culminating in devices th ...

2020

Enabling Optimal Power Generation of Flow Cell Arrays in 3D MPSoCs with On-Chip Switched Capacitor Converters

David Atienza Alonso, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse, Halima Najibi

Flow cell arrays (FCAs) provide efficient on-chip liquid cooling and electrochemical power generation capabilities in three-dimensional multi-processor systems-on-chip (3DMPSoCs). When connected to power delivery networks (PDNs) of chips, the current flowi ...

IEEE2020

Increasing Functionality of III-V Nanowires on Silicon Substrates

Wonjong Kim

Progress in nanotechnology, including fabrication and characterization tools, opened up the unprecedented low dimensional materials era, where we can manipulate and structure matter on a size scale that we could not reach before. Due to many interesting pr ...

EPFL2020

Transient current technique for charged traps detection in silicon bonded interfaces

Jean-Michel Sallese, Didier Bouvet, Alessandro Mapelli

Wafer bonding is an established technology for the manufacturing of silicon-on-insulator (SOI) substrates, microelectromechanical systems (MEMS) and microfluidic devices. Low temperature direct bonding techniques can be of particular interest for the fabri ...

2019

A Design Framework for Thermal-Aware Power Delivery Network in 3D MPSoCs with Integrated Flow Cell Arrays

Marina Zapater Sancho, Alexandre Sébastien Julien Levisse, Halima Najibi

Integrated Flow Cell Array (FCA) technology promises to address the power delivery and heat dissipation challenges in three-dimensional Multi Processor Systems-on-Chips (3D MPSoCs) by providing combined inter-tier liquid cooling and power generation capabi ...

2019

Rapid identification and interpretation of gene‐environment associations using the new R.SamBada landscape genomics pipeline

Stéphane Joost, Oliver Michele Selmoni, Estelle Rochat, Sylvie Stucki, Kevin Leempoel, Elia Vajana, Solange Catherine Gaillard

Samβada is a genome‐environment association (GEA) software, designed to search for signatures of local adaptation. However, pre‐ and post‐processing of data can be labour‐intensive, preventing wider uptake of the method. We have now developed R.SamBada, an ...

2019

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Mikhail Asiatici, Göran Stemme

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are ch ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2018

Learning-Based Hardware Design for Data Acquisition Systems

Cosimo Aprile

This multidisciplinary research work aims to investigate the optimized information extraction from signals or data volumes and to develop tailored hardware implementations that trade-off the complexity of data acquisition with that of data processing, conc ...

EPFL2018

Progress in single-photon avalanche diode image sensors in standard CMOS: From two-dimensional monolithic to three-dimensional-stacked technology

Edoardo Charbon, Myung Jae Lee

Single-photon detection and photon counting are useful tools in many fields, from light detection and ranging (LiDAR) to biomedical imaging and from time-resolved Raman spectroscopy to quantum applications. In this context, recently, single-photon avalanch ...

IOP PUBLISHING LTD2018