Publications related to Dual in-line package

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Rafael Medina Morillas, Joshua Alexander Harrison Klein

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

Subharmonic parametric instability in nearly brimful circular cylinders: a weakly nonlinear analysis

François Gallaire, Alessandro Bongarzone, Francesco Viola

In labscale Faraday experiments, meniscus waves respond harmonically to small-amplitude forcing without threshold, hence potentially cloaking the instability onset of parametric waves. Their suppression can be achieved by imposing a contact line pinned at ...

Cambridge University Press2022

Integration of hybrid material systems in conformable neural interfaces

Florian Dylan Fallegger

Neural interfaces are devices that are implanted into the body and interface electrically with the central (CNS) or peripheral nervous system. They are inserted surgically for short periods of time or chronically to diagnose or treat several neural disease ...

EPFL2020

Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits

Elison de Nazareth Matioli, Remco Franciscus Peter van Erp, Luca Nela, Georgios Kampitsis, Reza Soleiman Zadeh Ardebili

In this work, we demonstrate a new thermal management approach for direct cooling of GaN-on-Si power integrated circuits (ICs), in which the Si substrate functions as a microfluidic heat sink, turning Si into a cost-effective, high thermal performance subs ...

IEEE2020

A Real-Time Multi-Camera Depth Estimation ASIC with Custom On-Chip Embedded DRAM

Jonathan Emmanuel D Narinx

The capability to process high-resolution videos in real-time is becoming more important in a wide variety of applications such as autonomous vehicles, virtual reality or intelligent surveillance systems. The high-accuracy and complex video processing algo ...

EPFL2019

Rapid identification and interpretation of gene‐environment associations using the new R.SamBada landscape genomics pipeline

Stéphane Joost, Oliver Michele Selmoni, Estelle Rochat, Sylvie Stucki, Kevin Leempoel, Elia Vajana, Solange Catherine Gaillard

Samβada is a genome‐environment association (GEA) software, designed to search for signatures of local adaptation. However, pre‐ and post‐processing of data can be labour‐intensive, preventing wider uptake of the method. We have now developed R.SamBada, an ...

2019

Pediatric Size Swallowable Glass Pill for Digestive Motility Analysis

Catherine Dehollain, Vincent Schlageter, Onur Kazanç

A glass pill for digestive motility tracking with wireless communication is presented. The pill encapsulates three magnetic transmitter coils with a 125 kHz signal, the circuitry required to control the magnetic coil output and the battery. The system prov ...

IEEE2018

Learning-Based Hardware Design for Data Acquisition Systems

Cosimo Aprile

This multidisciplinary research work aims to investigate the optimized information extraction from signals or data volumes and to develop tailored hardware implementations that trade-off the complexity of data acquisition with that of data processing, conc ...

EPFL2018

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon, Thierry Hessler

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network

David Atienza Alonso, Arvind Raj Mahankali Sridhar

Microchannel liquid cooling has been proposed since the late 2000s as a viable enabler for 3D integration of microprocessors to continue scaling of computing power in the face of increasingly reduced returns from CMOS technology scaling. Thermal and electr ...

ACM/IEEE Press2015

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

John Richard Thome, Jackson Braz Marcinichen, Yassir Madhour, Brian Paul D'Entremont, Bruno Michel

Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and t ...

American Society of Mechanical Engineers2014

Comparison of Two Approaches for Nuclear Data Uncertainty Propagation in MCNPX for Selected Fast Spectrum Critical Benchmarks

Andreas Pautz, Hakim Ferroukhi, Dimitri Rochman, Tiankai Zhu, Alexander Vasiliev

Nuclear data uncertainty propagation based on stochastic sampling ( SS) is becoming more attractive while leveraging modern computer power. Two variants of the SS approach are compared in this paper. The Total Monte Carlo (TMC) method by the Nuclear Resear ...

Academic Press Inc Elsevier Science2014

An implantable biosensor array for personalized therapy applications

Andrea Cavallini

At present, most of the tests involved in personalized medicine are complex and must be conducted in specialized centers. The development of appropriate, fast and inexpensive diagnostic technologies can encourage medical personnel in performing preventive ...

EPFL2013

Miniature curved artificial compound eyes

Dario Floreano, Ramon Pericet Camara, Géraud L'Eplattenier, Michal Karol Dobrzynski

In most animal species, vision is mediated by compound eyes, which offer lower resolution than vertebrate single-lens eyes, but significantly larger fields of view with negligible distortion and spherical aberration, and high temporal resolution in a tiny ...

National Academy of Sciences2013

A 2D/3D image analysis system to track fluorescently labeled structures in rod-shaped cells: application to measure spindle pole asymmetry during mitosis

Michaël Unser, Daniel Sage, Viesturs Simanis, Daniel Andreas Schmitter, Anastasia Chasapi, Ioannis Xenarios

Background: The yeast Schizosaccharomyces pombe is frequently used as a model for studying the cell cycle. The cells are rod-shaped and divide by medial fission. The process of cell division, or cytokinesis, is controlled by a network of signaling proteins ...

Biomed Central Ltd2013

A Passive Louver-Based Daylighting System

Marilyne Andersen

A daylighting system for use in a building including a louver array having a first longitudinal element, and a second longitudinal element spaced therefrom. At least one of the first and second elements has an asymmetrical profile, each of the first and se ...

United States Patent and Trademark Office (USPTO)2013

An analysis of destination choice for opaque airline products using multidimensional binary logit models

Michel Bierlaire, Alexandre Khelifa

We investigate how customers respond to an opaque airline product offered by a European carrier. In this opaque product design, customers are randomly assigned to travel to one of approximately ten destinations; however, for a fee they may exclude one or m ...

Pergamon-Elsevier Science Ltd2012

Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology

Gabriele Tasselli

This paper deals with 24-GHz circuits developed by exploiting a system-in-package approach. In order to reduce the cost as much as possible, a standard multilayer printed circuit board (PCB) technology has been adopted. Such a circuit consists of a package ...

Institute of Electrical and Electronics Engineers2012

Soudure par interdiffusion dans les systèmes Au-In et In-Ni : application à des composants microélectroniques

Léa Deillon

Hermiticity is an essential requirement of a MEMS package for a device to work properly. Hermeticity also must be preserved during the operations following packaging, during which the package bond should not remelt. Bonding temperature is limited however t ...

EPFL2012