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Related publications (29)

Microfluidic Scintillation Detectors for High Energy Physics

Pietro Maoddi

This thesis deals with the development and study of microfluidic scintillation detectors, a technology of recent introduction for the detection of high energy particles. Most of the interest for such devices comes from the use of a liquid scintillator, whi ...

EPFL2015

Ultra Fine-Pitch TSV Technology for Ultra-Dense High-Q RF Inductors

Mihai Adrian Ionescu, Montserrat Fernandez-Bolanos Badia, Wolfgang Amadeus Vitale, Josef Weber

We demonstrate that fine-pitch TSV technology can be exploited to fabricate micro-inductors on high resistivity substrate, with record-high inductance per area and preserving their performance at GHz frequencies. We report an extensive experimental study o ...

2015

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Fabrizio Vecchio

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies f ...

EPFL2013

High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

Nico de Rooij, Danick Briand, Terunobu Akiyama, Rokhaya Gueye

A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS elec ...

SPIE - International Society of Optical Engineering2013

Cell Transformations and Physical Design Techniques for 3D Monolithic Integrated Circuits

Giovanni De Micheli, Shashi Kanth Bobba

3D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. In 3DMI technology the 3D contacts, connecting different active layers, are in the order of few 100 nm. Given the advantage of ...

2013

Design Methodologies and CAD for Emerging Nanotechnologies

Shashi Kanth Bobba

With technology scaling reaching the fundamental limits of Si-CMOS in the near future, the semiconductor industry is in quest for innovation from various disciplines of integrated circuit (IC) design. At a fundamental level, technology forms the main drive ...

EPFL2013

An Implantable Bio-Micro-system for Drug Monitoring

Giovanni De Micheli, Sandro Carrara, Catherine Dehollain, Camilla Baj-Rossi, Seyedeh Sara Ghoreishizadeh, Enver Gürhan Kilinç

Multi-target and continuous monitoring by wireless implantable devices is of increasing interest for personalized therapy. In this work an implantable system is presented which is capable of measuring different drugs with Cyclic Voltammetry (CV) method. Th ...

2013

3D structuration of LTCC and related technologies for thermal management and microfluidic structures

Peter Ryser, Thomas Maeder, Caroline Jacq, Bo Jiang, Fabrizio Vecchio, Conor Joseph Slater

Ceramic technologies such as LTCC (Low Temperature Co-fired Ceramic) and thick-film are used widely in electronic circuits exposed to harsh environments, for applications in fields such as aerospace, automotive and energy exploration, where, owing to their ...

Soc Microelectronics, Electron Components Materials-Midem2012

Long-term mechanical reliability of ceramic thick-film circuits and mechanical sensors under static load

Peter Ryser, Thomas Maeder, Caroline Jacq

In this work, we study the long-term mechanical strength under static load - i.e. static fatigue performance or resistance to subcritical crack growth - of ceramic thick-film circuits, namely how the static fatigue of the substrate is affected by the prese ...

Elsevier2012

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