Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...
Nowadays, scientific advances are leading to the discovery of newer, better, more targeted treatments that will improve the human health. However, despite the promising results and the major advantages in treatments offered to patients, these personalized ...
Optical components like resonator or waveguides often have stringent requirements in term of positioning accuracy during packaging. While this can be done routinely in a laboratory environment, permanently positioning and aligning optical elements with nan ...
A new open-source software platform that, among others, allows to select models for inertial sensor stochastic calibration is presented in this paper. This platform consists in a package included in the statistical software R. The identification of stochas ...
Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...
Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and t ...
