Ni-P electroless coatings are widely applied for protection of magnesium alloys and other materials due to the low energy consumption of the process and high resistance to corrosion and wear, properties that can be improved with the incorporation of partic ...
There is tremendous interest in reducing losses caused by the metal contacts in silicon photovoltaics, particularly the optical and resistive losses of the front metal grid. One commonly sought-after goal is the creation of high aspect-ratio metal fingers ...
In this paper, a die-level CMOS post-processing scheme for 3D integration using the via-last approach is presented for multi-layer stacking. The process includes TSV fabrication, chip-to-chip bonding, and finally the TSV filling with Cu electroplating. The ...
Intermetallic phases formation is one of the phenomena, which when coupled to thermal and mechanical strains leads to the premature wear of aluminium die casting tools made out of steel. This work focuses on two aspects of this wear problem. The first and ...
In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and thinned chips. Then, chip-to-chip bonding and TSV fabrication steps are accomplished in wafer-lev ...
The invention relates to a device comprising a conductive surface (12) and electrical contacts (14) by which an electric current is able to be passed. Said electrical contacts (14) comprise conductive seeds (16) deposited on the conductive surface (12), an ...
In the frame of this thesis, we have developed a novel batch-type technology for the realization of three-dimensional millimeter-size transformers for ultra-small low-power (0.1-1 Watt) applications. The technology is based on the three-dimensional micropa ...
