Creep (deformation)

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Related publications (30)

Nanomechanical Modeling of the Bending Response of Silicon Nanowires

Yusuf Leblebici, Zuhal Tasdemir, Mohammad Nasr Esfahani, Mustafa Yilmaz

Understanding the mechanical behavior of silicon nanowiresis essentialfor the implementation of advanced nanoscale devices. Although bendingtests are predominantly used for this purpose, their findings shouldbe properly interpreted through modeling. Variou ...

AMER CHEMICAL SOC2023

A fully-coupled highly-parallelized geomechanical simulator for assessing induced seismicity

Jean-François Molinari, Brice Tanguy Alphonse Lecampion, Guillaume Anciaux, Nicolas Richart, Emil Gallyamov

Induced seismicity caused by anthropogenic modification of the subsurface effective stress state has been observed in a number of industrial applications -- from hydrocarbon extraction (e.g., Groningen [1]), drilling waste-water disposal (e.g., [2]) to the ...

2023

The new Chapter 9 of Eurocode 8 Part 3 for Seismic Assessment of Existing Steel Structures

Dimitrios Lignos

The seismic assessment of existing steel structures necessitates the development of practice- oriented engineering models for use in nonlinear static and dynamic analysis procedures. These models should encompass the full range of the anticipated nonlinear ...

2023

Microscopic Digital Image Correlation Analysis of Strain Distributions in Stainless Steel 316L Induced by Multiaxial Cyclic Loading

Elif Cansu Kursun

Fatigue damage in materials results in localized strain at the microstructural level. In many engineering components of the cooling circuits of nuclear power plants, where austenitic steels are used, the material experiences multiaxial cyclic loading, eith ...

EPFL2023

Tailor-made Piezoelectric Elastomer Materials

Francis Owusu

Recent advancements in miniature devices with higher computational capabilities and ultralow power consumption have accelerated the development of wearable sensors, actuators, and energy harvesters everywhere. The ultimate aim of such a technological revol ...

EPFL2023

Laser powder bed fusion of Fe-based shape memory alloys for novel structural metamaterials and "smart" structures

Irene Ferretto

Laser powder bed fusion (LPBF) is a powder-based additive manufacturing (AM) technique, which shows great potential in the production of complex-shaped parts with unprecedented design freedom. In addition, it allows for an active manipulation of the micros ...

EPFL2023

Automated neuron tracking inside moving and deforming C. elegans using deep learning and targeted augmentation

Sahand Jamal Rahi, Kseniia Korchagina

Reading out neuronal activity from three-dimensional (3D) functional imaging requires segmenting and tracking individual neurons. This is challenging in behaving animals if the brain moves and deforms. The traditional approach is to train a convolutional n ...

Nature Portfolio2023

Simple shear extrusion versus equal channel angular pressing: A comparative study on the microstructure and mechanical properties of an Mg alloy

Roland Logé, Cyril Cayron, Aryan Rezaei Rad

Two severe plastic deformation (SPD) techniques of simple shear extrusion (SSE) and equal channel angular pressing (ECAP) were employed to process an extruded Mg -6Gd -3Y -1.5Ag (wt%) alloy at 553 K for 1, 2, 4 and 6 passes. The microstructural evolutions ...

KEAI PUBLISHING LTD2023

Microstructure et usinabilité d'alliages de titane béta-métastable

Loïc Favre

Titanium has become in recent years an interesting material in many applications that require a combination of high mechanical properties and low density. It has the peculiarity of undergoing an allotropic transformation at 882°C. Below this temperature, ...

EPFL2023

Dynamic control of high-voltage actuator arrays by light-pattern projection on photoconductive switches

Herbert Shea, Amir Firouzeh, Edouard Franck Vincent Gustave Leroy, Vesna Bacheva, Aiste Balciunaite

The ability to control high-voltage actuator arrays relies, to date, on expensive microelectronic processes or on individual wiring of each actuator to a single off-chip high-voltage switch. Here we present an alternative approach that uses on-chip photoco ...

SPRINGERNATURE2023

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