Publications related to Packaging engineering

Tunable biocomposite films fabricated using cellulose nanocrystals and additives for food packaging

Cellulose nanocrystals (CNCs) are considered a prospective packaging material to partially replace petroleumbased plastics attributed to their renewability, sustainability, biodegradability, and desirable attributes including transparency, oxygen, and oil ...

ELSEVIER SCI LTD2023

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Linear and nonlinear applications of miniaturized silicon nitride microresonators

Arslan Sajid Raja

Photonic integrated circuits (PICs) are the subject of massive interest due to the range of applications they can provide at a huge scale while building on well-established CMOS technologies. One of the critical parameters defining a technology's maturity ...

EPFL2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

An analysis of destination choice for opaque airline products using multidimensional binary logit models

Michel Bierlaire, Alexandre Khelifa

We investigate how customers respond to an opaque airline product offered by a European carrier. In this opaque product design, customers are randomly assigned to travel to one of approximately ten destinations; however, for a fee they may exclude one or m ...

Pergamon-Elsevier Science Ltd2012

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. ...

Trans Tech Publications2012

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. ...

Trans Tech Publications Ltd2012

Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology

Gabriele Tasselli

This paper deals with 24-GHz circuits developed by exploiting a system-in-package approach. In order to reduce the cost as much as possible, a standard multilayer printed circuit board (PCB) technology has been adopted. Such a circuit consists of a package ...

Institute of Electrical and Electronics Engineers2012

Nonparametric Construction of Multivariate Kernels

Victor Panaretos, Kjell Konis

We propose a nonparametric method for constructing multivariate kernels tuned to the configuration of the sample, for density estimation in R-d, d moderate. The motivation behind the approach is to break down the construction of the kernel into two parts: ...

American Statistical Association2012

Implantable Antennas for Biomedical Applications

Francesco Merli

Since the introduction of implantable pacemakers in the early 1960s, implantable medical devices have become more and more interesting for healthcare services. Nowadays, the devices designed to monitor physiological data from inside the human body have gre ...

EPFL2011

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Frank Seigneur

The quantity of MEMS manufacturers has considerably been increasing these last years. This doesn't mean that the introduction of such products on the market has become easier. A packaging operation is needed to obtain a usable product out of a microsystem. ...

EPFL2009

Evaluation of two commercial finite element packages for calculating AC losses in 2-D high temperature superconducting strips

Francesco Grilli, François Roy, Frédéric Sirois, Bertrand Dutoit, Bertrand Dutoit

This paper compares the speed and accuracy of two commercial packages based on the finite element method (FEM) for calculating the AC losses in high temperature superconductors (HTS). The softwares investigated in this paper were COMSOL Multiphysics and FL ...

2008

Hybrid nanocomposite gas-barrier coatings on polymers

Bandeep Singh

Gas barrier coatings based on single or multiple layers of metals, oxides or nitrides are widely used on polymer substrates in applications ranging from food packaging to organic displays and solar cells. These coatings exhibit a residual permeability resu ...

EPFL2007

Laser soldered packaging hermeticity measurement using metallic conductor resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

2006

Gas-barrier material

Yves Leterrier

The invention relates to novel gas-barrier materials for food packaging, based on transparent nanosized hybrid organic/inorganic films on polymer substrates. By contrast with current brittle oxides, these new materials combine extremely high cohesive stren ...

2006

Laser Sealed Packaging for Microsystems

Jacques Jacot, Frank Seigneur

Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...

2006

Laser Soldered Packaging Hermeticity Measurement Using Metallic Conductor Resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

2006

A Simulation Methodology for Reliability Analysis in Multi-Core SoCs

Giovanni De Micheli, Yusuf Leblebici, Ayse Kivilcim Coskun

Reliability has become a significant challenge for system design in new process technologies. Higher integration levels dramatically increase power densities, which leads to higher temperature and adverse effects on reliability. In this paper, we introduce ...

ACM Press2006