Etching (microfabrication)

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Related publications (24)

System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafers

Edoardo Charbon, Sandro Carrara, Simone Frasca, Rebecca Camilla Leghziel

A method for manufacturing vias in a silicon wafer, the silicon wafer having a crystal orientation, and having a plane that is perpendicular to a surface of the wafer, tilted by 35.26°, the method comprising the steps of providing a mask having ...

2021

The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

Edoardo Charbon, Sandro Carrara, Simone Frasca, Rebecca Camilla Leghziel

We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturin ...

Nature Research2021

3D metal freeform micromanufacturing

Andreas Mortensen, Yves Bellouard, Raphaël Charvet, Fatmah Ebrahim, Cyril Dénéréaz, Léa Deillon, Tao Yang, Enrico Casamenti, Luciano Borasi, Sacha Jérémy Florentin Pollonghini

Despite remarkable progress made in recent years, producing freeform three-dimensional micro-components out of copper, silver or gold and their alloys remains an engineering challenge: current processes are either too slow to be economically viable, or pro ...

2021

Shining Diamond: from Micro- and Nano-Engineering to Quantum Photonics

Sichen Mi

The discovery of room-temperature single photon emission from color centers in diamond has in recent years boosted research interest in this renowned material in photonics and quantum community and beyond. Following understanding some basic principles of h ...

EPFL2021

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