Course

EE-330: Digital IC design

Lectures in this course (17)

Digital Integrated Circuits: Evolution and Design

Covers the evolution of digital integrated circuits, market demands impact, modern IC functionalities, microprocessors history, and Moore's law.

VLSI Basics: Design and Technology

Covers VLSI design basics, including scaling, technology, MOSFET operation, and logic circuit implementation.

Logic Design: Basic Rules and Shannon's Expansion

Covers basic rules of logic design and Shannon's expansion in Boolean functions.

CMOS Inverter Fabrication

Explores the fabrication process of a CMOS inverter, covering thermal oxidation, doping processes, diffusion, ion implantation, and pattern transfer.

Thin-Film Processing: Removal and Deposition

Explores thin-film removal and deposition techniques in CMOS technology, covering wet etching, dry etching, chemical mechanical polishing, and thin-film deposition methods.

Fabrication Technology

Covers the process integration in semiconductor fabrication, including twin-well process, isolation methods, threshold voltage adjustment, and silicide formation.

Layout and Design Rules

Introduces layout designs in integrated circuits, covering design rules, physical layouts, and CMOS latch-up prevention.

Physical Design Basics

Introduces the basics of physical design in VLSI chip design, emphasizing layout features, power supply wiring, and gate layout optimization.

Delay Models: Resistance, Capacitance, and Inductance

Explores resistance, capacitance, and inductance calculations, MOS transistors, delay models, power dissipation, and PVT variations.

Static Logic Fundamentals

Covers the fundamentals of static logic, including noise immunity, noise margins, and various logic gate designs.

Dynamic Logic: Basics and Implementations

Explores dynamic logic fundamentals, hazards, charge-sharing issues, clocking schemes, and various implementations to enhance performance.

Sequential Logic Designs

Introduces clocked systems, sequential circuits, bistable-state devices, metastable states, and D-type flip-flops.

Dynamic Memory Elements: Latches and Flip-Flops

Covers dynamic memory elements, latches, flip-flops, timing parameters, clock skew, and synchronous pipelining.

Datapath Subsystems Design

Covers the design of datapath subsystems, focusing on basic combinational components and various implementation options for adders, multipliers, and shifters.

Datapath Subsystems Design

Covers the design of datapath subsystems, focusing on various types of adders and multiplication algorithms.

Memory Design: Organization & Operation

Covers memory classification, organization, and design of semiconductor memories like SRAM, DRAM, and MRAM.

Memory Design: Column Multiplexers

Delves into memory design, specifically column multiplexers and DRAM cell structures.