Covers the history, trends, challenges, and applications of printed electronics, emphasizing large area manufacturing processes and flexible substrates.
Explores printing techniques for electronics, including resolution trade-offs and pattern fidelity requirements, emphasizing the importance of choosing the right method.
Explores encapsulation in OLED technology, covering packaging materials, defects, thin film encapsulation, barrier mechanics, and new packaging materials.
Explores the fabrication and principles of printed humidity and temperature sensors, along with organic electrochemical transistors as versatile sensors.
