Lectures in course MICRO-534: Advanced MEMS & microsystems

Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.

Explores MEMS packaging techniques, including bonding methods and key considerations for ensuring reliability and functionality.

Explores advanced MEMS packaging technologies, including 3D integration, hermetic packaging, and wafer-level packaging processes.

Covers hermetic capping, getters, vacuum requirements, leak rate measurement, and testing methods in MEMS packaging.

Explores thermoelectric power generation, including the Seebeck effect, material properties, and efficiency considerations.

Covers PowerMEMS, energy harvesting, power storage, alternative energy sources, micro power devices, and the origins of PowerMEMS.