Lecture

MEMS Packaging: 3D Integration & Advanced Technologies

Related lectures (18)

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.

Chip Packaging Process Flow: Major Steps

Covers the major steps in chip packaging and the evolution of packaging technologies.

Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.

Packaging of Intelligent Systems

Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.

MEMS Resonators and Oscillators

Explores MEMS resonators and oscillators, CMOS integration, frequency stability, temperature drift compensation, resonator packaging, and advanced resonator structures.

VLSI Testing: Techniques and Economics

Explores test techniques for digital VLSI systems, covering fault modeling, test-pattern generation, and design for testability.

Infrared Photodetectors: Mercury Cadmium Telluride Technology

Covers the technology and applications of Mercury Cadmium Telluride photoconductors in infrared detection systems.

Semiconductor Nanowire Biosensors

Explores the use of semiconductor nanowires as biosensors for label-free detection of charged analytes, emphasizing high sensitivity and the need for further research.

Test of VLSI Systems

Covers test techniques for digital VLSI systems, including fault modeling and design for testability.

Emerging Memory I

Explores the landscape of big data, memory importance in online services, challenges faced by memory systems, emerging DRAM technologies, and storage-class memory.

MEMS Packaging: Techniques and Considerations

Explores MEMS packaging techniques, including bonding methods and key considerations for ensuring reliability and functionality.

Dry Etching of Organic and Metal Films

Explores anisotropic etching of organic films and Al alloys, emphasizing the role of Al2O3 in Al etching and presenting examples of dry etching processes.

Memory Cache: Storage and Network

Explores cache memory, data organization impact, storage structuring, communication protocols, and packet switching in computer networks.

Designing Information Systems: Lessons from CompuSys

Explores challenges in designing effective information systems using the case study of CompuSys.

Molecular Transistors: Design and Simulation

Explores molecular transistors for logic computation, design, simulation, and fabrication, emphasizing interconnect parasitics and device performance.

MEMS: Advanced Introduction

Covers advanced topics in MEMS technology, including design, packaging, device categories, historical perspective, market trends, and the role of startups.

Integrated Circuits: Evolution and Fabrication

Explores the evolution of integrated circuits, from transistors to CMOS technology, highlighting key historical milestones.

SSL Certificate Deployment for ENAC Web Hosting

Focuses on SSL certificate deployment for ENAC Web Hosting, covering certificate generation, debugging, and Ansible playbook management.