Lecture

PVD 3: Sputtering and Paschen's Law

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Explores plasma formation, sheath creation, and plasma etching applications for integrated circuit manufacturing.

Explores industrial plasma applications, breakdown phenomena, and plasma chemistry challenges, including gas-phase reactions and transport processes.

Explores breakdown phenomena in low-pressure gases, including Townsend's criterion, Paschen's law, and numerical simulations.

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Covers the process of etching using wet and dry techniques, explaining definitions, steps, examples, challenges, and solutions.

Explores various dry etching techniques for silicon and the equipment used in the process, including RF plasma sources and HF vapor phase etchers.

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