Lecture

Packaging of Intelligent Systems

Related lectures (31)

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MEMS Packaging: Techniques and Considerations

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Covers the technology and applications of Mercury Cadmium Telluride photoconductors in infrared detection systems.

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Covers advanced topics in MEMS technology, including design, packaging, device categories, historical perspective, market trends, and the role of startups.

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Covers energy dissipation in VLSI chips, focusing on subthreshold current in NMOS transistors and the effects of threshold voltage on power consumption.

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Offers a historical journey through VLSI technology, covering key milestones, challenges, and future prospects in the field.

VLSI Testing: Techniques and Economics

Explores test techniques for digital VLSI systems, covering fault modeling, test-pattern generation, and design for testability.

Test of VLSI Systems

Covers test techniques for digital VLSI systems, including fault modeling and design for testability.

Molecular Transistors: Design and Simulation

Explores molecular transistors for logic computation, design, simulation, and fabrication, emphasizing interconnect parasitics and device performance.

Digital Integrated Circuits: Evolution and Design

Covers the evolution of digital integrated circuits, market demands impact, modern IC functionalities, microprocessors history, and Moore's law.

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Cellulose: The New Plastic

Explores cellulose as a sustainable alternative to plastic, focusing on high-performance materials and challenges in replacing plastic packaging.

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Explores biochip interfacing, packaging, sensor measurement, microfluidics, and startup setup in the biochip industry.

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Explores molecular transistor simulation, covering clock effects, charge distribution, cascading arrays, and circuit fabrication.