Publications by Yüksel Temiz | EPFL Graph Search

Post-cmos processing and 3d integration based on dry-film lithography

Yusuf Leblebici, Yüksel Temiz, Carlotta Guiducci

A method for performing a post processing pattern on a diced chip having a foot-print, comprises the steps of providing a support wafer; applying a first dry film photoresist to the support wafer; positioning a mask corresponding to the footprint of the di ...

2015

Design and characterization of micromachined sensor array integrated with CMOS based optical readout

Yusuf Leblebici, Yüksel Temiz, Refik Burak Erarslan, Ulas Adiyan

This paper reports a micro electro-mechanical system (MEMS) based sensor array integrated with CMOS-based optical readout. The integrated architecture has several unique features. MEMS devices are passive and there are no electrical connections to the MEMS ...

Elsevier2014

A 0.18 mu m Biosensor Front-End Based on 1/f Noise, Distortion Cancelation and Chopper Stabilization Techniques

Christian Enz, Yüksel Temiz, Carlotta Guiducci, Anna Ferretti

This paper presents a novel sensor front-end circuit that addresses the issues of 1/f noise and distortion in a unique way by using canceling techniques. The proposed front-end is a fully differential transimpedance amplifier (TIA) targeted for current mod ...

Ieee-Inst Electrical Electronics Engineers Inc2013

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

Yusuf Leblebici, Yüksel Temiz, Carlotta Guiducci

This paper presents a chip-level postcomplementary metal oxide semiconductor (CMOS) processing technique for 3-D integration and through-silicon-via (TSV) fabrication. The proposed technique is based on dry-film lithography, which is a low-cost and simple ...

Ieee-Inst Electrical Electronics Engineers Inc2013

3D Integration Technology for Lab-on-a-Chip Applications

Yüksel Temiz

This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...

EPFL2012

Resistive Programmable Through Silicon Vias for Reconfigurable 3D Fabrics

Yusuf Leblebici, Giovanni De Micheli, Michail Zervas, Yüksel Temiz, Davide Sacchetto

In this letter we report on the fabrication and characterization of titanium dioxide (TiO2)-based resistive RAM (ReRAM) co-integration with 380 ìm-height Cu Through Silicon Via (TSV) arrays for programmable 3D interconnects. Nonvolatile resistive switching ...

Institute of Electrical and Electronics Engineers2012

A Comparative Study on Fabrication Techniques for On-Chip Microelectrodes

Yusuf Leblebici, Yüksel Temiz, Carlotta Guiducci, Anna Ferretti

This paper presents an experimental study on different microelectrode fabrication techniques, with particular focus on the robustness of the surface insulation towards typical working conditions required in lab-on-a-chip applications. Pt microelectrodes wi ...

Royal Society of Chemistry2012

Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology

Yusuf Leblebici, Panagiotis Athanasopoulos, Michail Zervas, Alessandro Cevrero, Yüksel Temiz, Giulia Beanato, Paolo Giovannini

An innovative modular 3-D stacked multi-processor architecture is presented. The platform is composed of completely identical stacked dies connected together by through-silicon-vias (TSVs). Each die features four 32-bit embedded processors and associated m ...

2012

A CMOS Compatible Chip-to-Chip 3D Integration Platform

Yusuf Leblebici, Michail Zervas, Yüksel Temiz, Carlotta Guiducci

In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and thinned chips. Then, chip-to-chip bonding and TSV fabrication steps are accomplished in wafer-lev ...

IEEE2012

Fabrication and characterization of wafer-level deep TSV arrays

Yusuf Leblebici, Michail Zervas, Yüksel Temiz

Three Dimensional (3D) integration, based on through silicon vias (TSV), has the potential to become a key enabling technology for many applications. TSVs are commonly categorized according to their aspect ratio and diameter. An equally important parameter ...

IEEE2012

Die-Level TSV Fabrication Platform for CMOS-MEMS Integration

Yusuf Leblebici, Michail Zervas, Yüksel Temiz, Carlotta Guiducci

This paper reports a new post-CMOS processing platform for die-level through-silicon-via (TSV) fabrication, based on wafer reconstitution from embedded dies, parylene deposition, stencil lithography, and bottom-up electroplating. The goal of this work is t ...

2011

3D Integration Technology for Lab-on-a-Chip Applications

Yusuf Leblebici, Samuel Kilchenmann, Yüksel Temiz, Carlotta Guiducci

A review is presented of advances and challenges in fully integrated systems for personalised medicine applications. One key issue for the commercialisation of such systems is the disposability of the assay-substrate at a low cost. This work adds a new dim ...

Institution of Engineering and Technology2011

Integrating Bio-sensing Functions on CMOS Chips

Yusuf Leblebici, Yüksel Temiz, Enrico Accastelli, Carlotta Guiducci, Anna Ferretti, Giulia Cappi, Elena Bianchi

The paper discusses the recent achievements in the development of chips with integrated sensing of biomolecules. In particular, it focuses on integrated sensing electrodes on silicon and presents innovative solutions for the enhanced robustness of the elec ...

Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2010

3D Architecture and Replaceable Layers for Label-Free DNA Biochips

Yusuf Leblebici, Andrea Cavallini, Yüksel Temiz, Sandro Carrara

Recent advances in bio-sensing technologies have led to design of bio-sensor arrays for rapid identification and quantification of various biological agents such as drugs, gene expressions, proteins, cholesterol, fats, etc. Various dedicated sensing arrays ...

2009

Real-time high-sensitivity impedance measurement interface for tethered BLM biosensor arrays

Horst Vogel, Samuel Terrettaz, Yusuf Leblebici, Giovanni De Micheli, Luca Benini, Yüksel Temiz, Carlotta Guiducci

This paper presents a switched-capacitor (SC) current integrator circuit for impedance measurement of tethered bilayer lipid membrane (tBLM) biosensors. The circuit comprises a small number of high performance components enabling enhanced experimental flex ...

2008