Chiara Falsetti

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Related publications (6)

Experimental Characterization of Different Condenser Technologies in a Passive Two-Phase Cooling System for Thermal Management of Electronics

John Richard Thome, Jackson Braz Marcinichen, Raffaele Luca Amalfi, Chiara Falsetti

Passive two-phase, micro-channel cooling for thermal management of electronics represents an efficient and viable solution to augment conventional air-cooling systems with the potential for higher power dissipation densities, increased reliability, reduced ...

IEEE2019

A new flow pattern-based boiling heat transfer model for micro-pin fin evaporators

John Richard Thome, Mirco Magnini, Chiara Falsetti

2018

Hydrodynamic and thermal analysis of a micro-pin fin evaporator for on-chip two-phase cooling of high density power micro-electronics

John Richard Thome, Mirco Magnini, Chiara Falsetti

2018

Experimental characterisation of the thermohydraulic performance of a micro-pin fin evaporator: Heat transfer, flow visualization and modelling

Chiara Falsetti

The global tendency towards miniaturization driven by the microelectronics industry is pushing system density and packaging towards unprecedented values of thermal design power, with a dramatic reduction of the surface area of the devices. Vertical integra ...

EPFL2018

Two-phase operational maps, pressure drop, and heat transfer for flow boiling of R236fa in a micro-pin fin evaporator

John Richard Thome, Navid Borhani, Hamideh Jafarpoorchekab, Mirco Magnini, Chiara Falsetti

Cooling the new generation of 3D high power electronic chips is one of the leading challenges in microelectronics, as it is a key to achieve high computational performance at lower cooling system power consumption, thus reducing the operating cost. Two-pha ...

Pergamon-Elsevier Science Ltd2017

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

John Richard Thome, Mirco Magnini, Chiara Falsetti

The development of newer and more efficient cooling techniques to sustain the increasing power density of high-performance computing systems is becoming one of the major challenges in the development of microelectronics. In this framework, two-phase coolin ...

Asme2017

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