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Jie Meng

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Related publications (2)

Please note that this is not a complete list of this person’s publications. It includes only semantically relevant works. For a full list, please refer to Infoscience.

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

David Atienza Alonso, Ayse Kivilcim Coskun, Arvind Raj Mahankali Sridhar, Jie Meng

Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel-based liquid cooling, however, can substantially increase the on-chip thermal gradients, ...

Institute of Electrical and Electronics Engineers2013

Attaining Single-Chip, High-Performance Computing Through 3D Systems with Active Cooling

David Atienza Alonso, Ayse Kivilcim Coskun, Mohamed Mostafa Sabry Aly, Jie Meng

Three-dimensional (3D) stacking is an attractive method for designing large manycore chips as it provides high transistor integration densities, improves manufacturing yield due to smaller chip area, reduces wirelength and capacitance, and enables heteroge ...

Institute of Electrical and Electronics Engineers2011