Chemical vapor depositionChemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.
Plasma-enhanced chemical vapor depositionPlasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.
Pulsed laser depositionPulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
Fluid dynamicsIn physics, physical chemistry and engineering, fluid dynamics is a subdiscipline of fluid mechanics that describes the flow of fluids—liquids and gases. It has several subdisciplines, including aerodynamics (the study of air and other gases in motion) and hydrodynamics (the study of liquids in motion). Fluid dynamics has a wide range of applications, including calculating forces and moments on aircraft, determining the mass flow rate of petroleum through pipelines, predicting weather patterns, understanding nebulae in interstellar space and modelling fission weapon detonation.
Evaporation (deposition)Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film. Evaporation involves two basic processes: a hot source material evaporates and condenses on the substrate. It resembles the familiar process by which liquid water appears on the lid of a boiling pot.
Nuclear reactorA nuclear reactor is a device used to initiate and control a fission nuclear chain reaction or nuclear fusion reactions. Nuclear reactors are used at nuclear power plants for electricity generation and in nuclear marine propulsion. Heat from nuclear fission is passed to a working fluid (water or gas), which in turn runs through steam turbines. These either drive a ship's propellers or turn electrical generators' shafts. Nuclear generated steam in principle can be used for industrial process heat or for district heating.
Atomic layer depositionAtomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors.
Fluid mechanicsFluid mechanics is the branch of physics concerned with the mechanics of fluids (liquids, gases, and plasmas) and the forces on them. It has applications in a wide range of disciplines, including mechanical, aerospace, civil, chemical, and biomedical engineering, as well as geophysics, oceanography, meteorology, astrophysics, and biology. It can be divided into fluid statics, the study of fluids at rest; and fluid dynamics, the study of the effect of forces on fluid motion.
Physical vapor depositionPhysical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.
Vacuum depositionVacuum deposition , also known as vacuum coating or thin-film deposition, is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings.
Newtonian fluidA Newtonian fluid is a fluid in which the viscous stresses arising from its flow are at every point linearly correlated to the local strain rate — the rate of change of its deformation over time. Stresses are proportional to the rate of change of the fluid's velocity vector. A fluid is Newtonian only if the tensors that describe the viscous stress and the strain rate are related by a constant viscosity tensor that does not depend on the stress state and velocity of the flow.
Electron-beam physical vapor depositionElectron-beam physical vapor deposition, or EBPVD, is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electron beam causes atoms from the target to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.
Flow velocityIn continuum mechanics the flow velocity in fluid dynamics, also macroscopic velocity in statistical mechanics, or drift velocity in electromagnetism, is a vector field used to mathematically describe the motion of a continuum. The length of the flow velocity vector is the flow speed and is a scalar. It is also called velocity field; when evaluated along a line, it is called a velocity profile (as in, e.g., law of the wall).
Compressible flowCompressible flow (or gas dynamics) is the branch of fluid mechanics that deals with flows having significant changes in fluid density. While all flows are compressible, flows are usually treated as being incompressible when the Mach number (the ratio of the speed of the flow to the speed of sound) is smaller than 0.3 (since the density change due to velocity is about 5% in that case). The study of compressible flow is relevant to high-speed aircraft, jet engines, rocket motors, high-speed entry into a planetary atmosphere, gas pipelines, commercial applications such as abrasive blasting, and many other fields.
Sputter depositionSputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).
Chemical reactorA chemical reactor is an enclosed volume in which a chemical reaction takes place. In chemical engineering, it is generally understood to be a process vessel used to carry out a chemical reaction, which is one of the classic unit operations in chemical process analysis. The design of a chemical reactor deals with multiple aspects of chemical engineering. Chemical engineers design reactors to maximize net present value for the given reaction.
Small modular reactorSmall modular reactors (SMRs) are a proposed class of nuclear fission reactors, smaller than conventional nuclear reactors, which can be built in one location (such as a factory), then shipped, commissioned, and operated at a separate site. The term SMR refers to the size, capacity and modular construction only, not to the reactor type and the nuclear process which is applied. Designs range from scaled down versions of existing designs to generation IV designs.
Generation IV reactorGeneration IV reactors (Gen IV) are nuclear reactor design technologies that are envisioned as successors of generation III reactors. The Generation IV International Forum (GIF) - an international organization that coordinates the development of generation IV reactors - specifically selected six reactor technologies as candidates for generation IV reactors. The designs target improved safety, sustainability, efficiency, and cost.
Breeder reactorA breeder reactor is a nuclear reactor that generates more fissile material than it consumes. These reactors can be fuelled with more commonly available isotopes of uranium and thorium, such as uranium-238 or thorium-232, as opposed to the rare uranium-235 which is used in conventional reactors. These materials are called fertile materials since they can be bred into fuel by these breeder reactors. Breeder reactors achieve this because their neutron economy is high enough to create more fissile fuel than they use.
Flow measurementFlow measurement is the quantification of bulk fluid movement. Flow can be measured using devices called flowmeters in various ways. The common types of flowmeters with industrial applications are listed below: Obstruction type (differential pressure or variable area) Inferential (turbine type) Electromagnetic Positive-displacement flowmeters, which accumulate a fixed volume of fluid and then count the number of times the volume is filled to measure flow. Fluid dynamic (vortex shedding) Anemometer Ultrasonic flow meter Mass flow meter (Coriolis force).
