Publication

Active microfluidic mixer using virtual source-sink pairs for DNA purification

Martinus Gijs, Caroline Vandevyver, Hüseyin Cumhur Tekin
2010
Conference Papers

Abstract

We present an active mixer based on the creation of virtual source-sink pairs in a polydimethylsiloxane (PDMS) chip. Perfect mixing is achieved in only a sub-second time interval for a compact 5 μL mixing volume. This excellent performance is achieved thanks to the implementation of co-rotating vortices inside the mixing chamber by using micro-plumbing technology. A DNA isolation and purification protocol using magnetic beads in the mixing chamber is per-formed on-chip, showing the enhanced DNA binding performance due to active mixing.

Official source

https://infoscience.epfl.ch/entities/publication/17966aae-04f8-4581-a1cd-dff12a569f2b

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Martinus Gijs, Caroline Vandevyver, Hüseyin Cumhur Tekin
2010
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/17966aae-04f8-4581-a1cd-dff12a569f2b

About this result

Related concepts (5)

System on a chip

A system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.

Multi-chip module

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".

Chip carrier

In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large. Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is "flat pack".

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