Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Graphics processing unitA graphics processing unit (GPU) is a specialized electronic circuit initially designed to accelerate computer graphics and (either on a video card or embedded on the motherboards, mobile phones, personal computers, workstations, and game consoles). After their initial design, GPUs were found to be useful for non-graphic calculations involving embarrassingly parallel problems due to their parallel structure. Other non-graphical uses include the training of neural networks and cryptocurrency mining.
Multi-core processorA multi-core processor is a microprocessor on a single integrated circuit with two or more separate processing units, called cores, each of which reads and executes program instructions. The instructions are ordinary CPU instructions (such as add, move data, and branch) but the single processor can run instructions on separate cores at the same time, increasing overall speed for programs that support multithreading or other parallel computing techniques.
Central processing unitA central processing unit (CPU)—also called a central processor or main processor—is the most important processor in a given computer. Its electronic circuitry executes instructions of a computer program, such as arithmetic, logic, controlling, and input/output (I/O) operations. This role contrasts with that of external components, such as main memory and I/O circuitry, and specialized coprocessors such as graphics processing units (GPUs). The form, design, and implementation of CPUs have changed over time, but their fundamental operation remains almost unchanged.
Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Manycore processorManycore processors are special kinds of multi-core processors designed for a high degree of parallel processing, containing numerous simpler, independent processor cores (from a few tens of cores to thousands or more). Manycore processors are used extensively in embedded computers and high-performance computing. Manycore processors are distinct from multi-core processors in being optimized from the outset for a higher degree of explicit parallelism, and for higher throughput (or lower power consumption) at the expense of latency and lower single-thread performance.
Physics processing unitA physics processing unit (PPU) is a dedicated microprocessor designed to handle the calculations of physics, especially in the physics engine of video games. It is an example of hardware acceleration. Examples of calculations involving a PPU might include rigid body dynamics, soft body dynamics, collision detection, fluid dynamics, hair and clothing simulation, finite element analysis, and fracturing of objects. The idea is having specialized processors offload time-consuming tasks from a computer's CPU, much like how a GPU performs graphics operations in the main CPU's place.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Vision processing unitA vision processing unit (VPU) is (as of 2023) an emerging class of microprocessor; it is a specific type of AI accelerator, designed to accelerate machine vision tasks. Vision processing units are distinct from video processing units (which are specialised for video encoding and decoding) in their suitability for running machine vision algorithms such as CNN (convolutional neural networks), SIFT (scale-invariant feature transform) and similar.
General-purpose computing on graphics processing unitsGeneral-purpose computing on graphics processing units (GPGPU, or less often GPGP) is the use of a graphics processing unit (GPU), which typically handles computation only for computer graphics, to perform computation in applications traditionally handled by the central processing unit (CPU). The use of multiple video cards in one computer, or large numbers of graphics chips, further parallelizes the already parallel nature of graphics processing.
Power managementPower management is a feature of some electrical appliances, especially copiers, computers, computer CPUs, computer GPUs and computer peripherals such as monitors and printers, that turns off the power or switches the system to a low-power state when inactive. In computing this is known as PC power management and is built around a standard called ACPI, this supersedes APM. All recent computers have ACPI support.
Low-power electronicsLow-power electronics are electronics, such as notebook processors, that have been designed to use less electric power than usual, often at some expense. In the case of notebook processors, this expense is processing power; notebook processors usually consume less power than their desktop counterparts, at the expense of lower processing power. watch The earliest attempts to reduce the amount of power required by an electronic device were related to the development of the wristwatch.
MultiprocessingMultiprocessing is the use of two or more central processing units (CPUs) within a single computer system. The term also refers to the ability of a system to support more than one processor or the ability to allocate tasks between them. There are many variations on this basic theme, and the definition of multiprocessing can vary with context, mostly as a function of how CPUs are defined (multiple cores on one die, multiple dies in one package, multiple packages in one system unit, etc.).
Package on a packagePackage on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
3D XPoint3D XPoint (pronounced three-D cross point) is a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and was available on the open market under the brand name Optane (Intel) from April 2017 to July 2022. Bit storage is based on a change of bulk resistance, in conjunction with a stackable cross-grid data access array. Initial prices are less than dynamic random-access memory (DRAM) but more than flash memory.
Intel CoreIntel Core is a line of streamlined midrange consumer, workstation and enthusiast computer central processing units (CPUs) marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets. The lineup of Core processors includes the Intel Core i3, Intel Core i5, Intel Core i7, and Intel Core i9, along with the X-series of Intel Core CPUs.
Direct3DDirect3D is a graphics application programming interface (API) for Microsoft Windows. Part of DirectX, Direct3D is used to render three-dimensional graphics in applications where performance is important, such as games. Direct3D uses hardware acceleration if it is available on the graphics card, allowing for hardware acceleration of the entire 3D rendering pipeline or even only partial acceleration.
Vector processorIn computing, a vector processor or array processor is a central processing unit (CPU) that implements an instruction set where its instructions are designed to operate efficiently and effectively on large one-dimensional arrays of data called vectors. This is in contrast to scalar processors, whose instructions operate on single data items only, and in contrast to some of those same scalar processors having additional single instruction, multiple data (SIMD) or SWAR Arithmetic Units.
Processor (computing)In computing and computer science, a processor or processing unit is an electrical component (digital circuit) that performs operations on an external data source, usually memory or some other data stream. It typically takes the form of a microprocessor, which can be implemented on a single metal–oxide–semiconductor integrated circuit chip. In the past, processors were constructed using multiple individual vacuum tubes, multiple individual transistors, or multiple integrated circuits. Today, processors use built-in transistors.
