System on a chipA system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.
Network on a chipA network on a chip or network-on-chip (NoC ˌɛnˌoʊˈsiː or nɒk ) is a network-based communications subsystem on an integrated circuit ("microchip"), most typically between modules in a system on a chip (SoC). The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules.
65 nm processThe 65 nm process is an advanced lithographic node used in volume CMOS (MOSFET) semiconductor fabrication. Printed linewidths (i.e. transistor gate lengths) can reach as low as 25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm. For comparison, cellular ribosomes are about 20 nm end-to-end. A crystal of bulk silicon has a lattice constant of 0.543 nm, so such transistors are on the order of 100 atoms across. By September 2007, Intel, AMD, IBM, UMC and Chartered were also producing 65 nm chips.
CMOSComplementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", siːmɑːs, -ɒs) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including CMOS BIOS), and other digital logic circuits.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Floorplan (microelectronics)In electronic design automation, a floorplan of an integrated circuit is a schematic representation of tentative placement of its major functional blocks. In modern electronic design process floorplans are created during the floorplanning design stage, an early stage in the hierarchical approach to integrated circuit design. Depending on the design methodology being followed, the actual definition of a floorplan may differ. Floorplanning takes in some of the geometrical constraints in a design.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Instruction set architectureIn computer science, an instruction set architecture (ISA), also called computer architecture, is an abstract model of a computer. A device that executes instructions described by that ISA, such as a central processing unit (CPU), is called an implementation. In general, an ISA defines the supported instructions, data types, registers, the hardware support for managing main memory, fundamental features (such as the memory consistency, addressing modes, virtual memory), and the input/output model of a family of implementations of the ISA.
Peripheral Component InterconnectPeripheral Component Interconnect (PCI) is a local computer bus for attaching hardware devices in a computer and is part of the PCI Local Bus standard. The PCI bus supports the functions found on a processor bus but in a standardized format that is independent of any given processor's native bus. Devices connected to the PCI bus appear to a bus master to be connected directly to its own bus and are assigned addresses in the processor's address space. It is a parallel bus, synchronous to a single bus clock.
Computer hardwareComputer hardware includes the physical parts of a computer, such as the case, central processing unit (CPU), random access memory (RAM), monitor, mouse, keyboard, computer data storage, graphics card, sound card, speakers and motherboard. By contrast, software is the set of instructions that can be stored and run by hardware. Hardware is so-termed because it is "hard" or rigid with respect to changes, whereas software is "soft" because it is easy to change. Hardware is typically directed by the software to execute any command or instruction.
Die shrinkThe term die shrink (sometimes optical shrink or process shrink) refers to the scaling of metal–oxide–semiconductor (MOS) devices. The act of shrinking a die creates a somewhat identical circuit using a more advanced fabrication process, usually involving an advance of lithographic nodes. This reduces overall costs for a chip company, as the absence of major architectural changes to the processor lowers research and development costs while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold.
GlobalFoundriesGlobalFoundries Inc. (GF) is a multinational semiconductor contract manufacturing and design company incorporated in the Cayman Islands and headquartered in Malta, New York. Created by the divestiture of the manufacturing arm of AMD, the company was privately owned by Mubadala Investment Company, the sovereign wealth fund of the United Arab Emirates, until an initial public offering (IPO) in October 2021. The company manufactures integrated circuits on wafers designed for markets such as mobility, automotive, computing and wired connectivity, consumer internet of things (IoT) and other industrial applications.
BreadboardA breadboard, solderless breadboard, or protoboard is a construction base used to build semi-permanent prototypes of electronic circuits. Unlike a perfboard or stripboard, breadboards do not require soldering or destruction of tracks and are hence reusable. For this reason, breadboards are also popular with students and in technological education. A variety of electronic systems may be prototyped by using breadboards, from small analog and digital circuits to complete central processing units (CPUs).
Computer engineeringComputer engineering (CoE or CpE) is a branch of electronic engineering and computer science that integrates several fields of computer science and electronic engineering required to develop computer hardware and software. Computer engineers require training in electronic engineering, computer science, hardware-software integration, software design, and software engineering. It uses the techniques and principles of electrical engineering and computer science, and can encompass areas such as artificial intelligence (AI), robotics, computer networks, computer architecture and operating systems.
PowerPCPowerPC (with the backronym Performance Optimization With Enhanced RISC – Performance Computing, sometimes abbreviated as PPC) is a reduced instruction set computer (RISC) instruction set architecture (ISA) created by the 1991 Apple–IBM–Motorola alliance, known as AIM. PowerPC, as an evolving instruction set, has been named Power ISA since 2006, while the old name lives on as a trademark for some implementations of Power Architecture–based processors.
Integrated circuit designIntegrated circuit design, or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography. IC design can be divided into the broad categories of digital and analog IC design. Digital IC design is to produce components such as microprocessors, FPGAs, memories (RAM, ROM, and flash) and digital ASICs.
Mobile deviceA mobile device (or handheld computer) is a computer, small enough to hold and operate in the hand. Mobile devices typically have a flat LCD or OLED screen, a touchscreen interface, and digital or physical buttons. They may also have a physical keyboard. Many such devices can connect to the Internet and connect with other devices such as car entertainment systems or headsets via Wi-Fi, Bluetooth, cellular networks or near field communication.
