Integration of MEMS in Silicon Photonics

Like integrated electronics, integrated photonics such as Silicon Photonics benefit from increased device-density on a single chip. Silicon is an excellent material for integrated photonics because its high refractive index allows devices to be made small, and the established silicon CMOS fabrication infrastructure provides a convenient route towards scaling up production. However, standard Silicon Photonics faces a bottleneck in scaling up device-density due to excessive power consumption and high optical losses associated with individual devices. Microelectromechanical systems (MEMS) provide a unique solution to this problem by providing a physical redistribution of optical media to perform the necessary active functions in photonic integrated circuits (PICs) with minimal power consumption and low loss.

This thesis tackles two important aspects needed for implementing large-scale MEMS-enabled PICs in silicon. First, the required microfabrication processes are developed for the first-time, by full process integration of MEMS in an established foundry platform, the Interuniversity Microelectronic Centre's (IMEC) iSiPP50G Silicon Photonics technology. By demonstrating MEMS-compatibility, the barrier to adopting this new technology is reduced, and the devices and circuits themselves benefit from co-integration with high-performance standard components. Second, a new class of electrostatic MEMS-enabled photonic building blocks are designed, simulated, and experimentally characterized. Demonstrated devices include a set of remarkably broadband (bandwidth > 80 nm) tunable couplers capable of continuous optical power tuning between output ports to produce extinction ratios greater than 20 dB with minimal insertion loss (reaching < 0.4 dB). In terms of switching, a very low-voltage, six-port count device and a particularly compact (65 um x 62 um) photonic MEMS switch with sub-microsecond switching time are also presented. Further MEMS-enabled functionality is demonstrated with a wavelength-selective add-drop filter and a discussion of phase-shifters and multi-device sub-circuits. These components can be repeated and combined with one another to create complex and reconfigurable networks, and therefore represent an essential stepping stone towards the realization of very large-scale PICs. Together, these key developments in microfabrication and device design promise PIC designers MEMS-enabled photonic components as standard elements in their circuits to efficiently implement functions such as switching, tuning, and filtering for application in photonic switch matrices, weighted interconnects for neural networks, and programmable PICs.