Equivalent circuitIn electrical engineering, an equivalent circuit refers to a theoretical circuit that retains all of the electrical characteristics of a given circuit. Often, an equivalent circuit is sought that simplifies calculation, and more broadly, that is a simplest form of a more complex circuit in order to aid analysis. In its most common form, an equivalent circuit is made up of linear, passive elements. However, more complex equivalent circuits are used that approximate the nonlinear behavior of the original circuit as well.
Lumped-element modelThe lumped-element model (also called lumped-parameter model, or lumped-component model) is a simplified representation of a physical system or circuit that assumes all components are concentrated at a single point and their behavior can be described by idealized mathematical models. The lumped-element model simplifies the system or circuit behavior description into a topology. It is useful in electrical systems (including electronics), mechanical multibody systems, heat transfer, acoustics, etc.
AdmittanceIn electrical engineering, admittance is a measure of how easily a circuit or device will allow a current to flow. It is defined as the reciprocal of impedance, analogous to how conductance and resistance are defined. The SI unit of admittance is the siemens (symbol S); the older, synonymous unit is mho, and its symbol is ℧ (an upside-down uppercase omega Ω). Oliver Heaviside coined the term admittance in December 1887.
Magnetic circuitA magnetic circuit is made up of one or more closed loop paths containing a magnetic flux. The flux is usually generated by permanent magnets or electromagnets and confined to the path by magnetic cores consisting of ferromagnetic materials like iron, although there may be air gaps or other materials in the path. Magnetic circuits are employed to efficiently channel magnetic fields in many devices such as electric motors, generators, transformers, relays, lifting electromagnets, SQUIDs, galvanometers, and magnetic recording heads.
LC circuitFile:LC parallel simple.svg|LC circuit diagram File:Low cost DCF77 receiver.jpg|LC circuit ''(left)'' consisting of ferrite coil and capacitor used as a tuned circuit in the receiver for a [[radio clock]] File:Tuned circuit of shortwave radio transmitter from 1938.jpg|Output tuned circuit of [[shortwave]] [[radio transmitter]] An LC circuit, also called a resonant circuit, tank circuit, or tuned circuit, is an electric circuit consisting of an inductor, represented by the letter L, and a capacitor, represented by the letter C, connected together.
Network analysis (electrical circuits)In electrical engineering and electronics, a network is a collection of interconnected components. Network analysis is the process of finding the voltages across, and the currents through, all network components. There are many techniques for calculating these values; however, for the most part, the techniques assume linear components. Except where stated, the methods described in this article are applicable only to linear network analysis.
Kirchhoff's circuit lawsKirchhoff's circuit laws are two equalities that deal with the current and potential difference (commonly known as voltage) in the lumped element model of electrical circuits. They were first described in 1845 by German physicist Gustav Kirchhoff. This generalized the work of Georg Ohm and preceded the work of James Clerk Maxwell. Widely used in electrical engineering, they are also called Kirchhoff's rules or simply Kirchhoff's laws. These laws can be applied in time and frequency domains and form the basis for network analysis.
Quality controlQuality control (QC) is a process by which entities review the quality of all factors involved in production. ISO 9000 defines quality control as "a part of quality management focused on fulfilling quality requirements". This approach places emphasis on three aspects (enshrined in standards such as ISO 9001): Elements such as controls, job management, defined and well managed processes, performance and integrity criteria, and identification of records Competence, such as knowledge, skills, experience, and qualifications Soft elements, such as personnel, integrity, confidence, organizational culture, motivation, team spirit, and quality relationships.
Q factorIn physics and engineering, the quality factor or Q factor is a dimensionless parameter that describes how underdamped an oscillator or resonator is. It is defined as the ratio of the initial energy stored in the resonator to the energy lost in one radian of the cycle of oscillation. Q factor is alternatively defined as the ratio of a resonator's centre frequency to its bandwidth when subject to an oscillating driving force. These two definitions give numerically similar, but not identical, results.
Quality (business)In business, engineering, and manufacturing, quality – or high quality – has a pragmatic interpretation as the non-inferiority or superiority of something (goods or services); it is also defined as being suitable for the intended purpose (fitness for purpose) while satisfying customer expectations. Quality is a perceptual, conditional, and somewhat subjective attribute and may be understood differently by different people. Consumers may focus on the specification quality of a product/service, or how it compares to competitors in the marketplace.
Quality managementQuality management ensures that an organization, product or service consistently functions well. It has four main components: quality planning, quality assurance, quality control and quality improvement. Quality management is focused not only on product and service quality, but also on the means to achieve it. Quality management, therefore, uses quality assurance and control of processes as well as products to achieve more consistent quality. Quality control is also part of quality management.
Software qualityIn the context of software engineering, software quality refers to two related but distinct notions: Software's functional quality reflects how well it complies with or conforms to a given design, based on functional requirements or specifications. That attribute can also be described as the fitness for purpose of a piece of software or how it compares to competitors in the marketplace as a worthwhile product. It is the degree to which the correct software was produced.
Sputter depositionSputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).
SusceptanceIn electrical engineering, susceptance (B) is the imaginary part of admittance (Y = G + jB), where the real part is conductance (G). The reciprocal of admittance is impedance (Z = R + jX), where the imaginary part is reactance (X) and the real part is resistance (R). In SI units, susceptance is measured in siemens (S). The term was coined by C.P. Steinmetz in a 1894 paper. In some sources Oliver Heaviside is given credit for coining the term, or with introducing the concept under the name permittance.
Integration by substitutionIn calculus, integration by substitution, also known as u-substitution, reverse chain rule or change of variables, is a method for evaluating integrals and antiderivatives. It is the counterpart to the chain rule for differentiation, and can loosely be thought of as using the chain rule "backwards". Before stating the result rigorously, consider a simple case using indefinite integrals. Compute Set This means or in differential form, Now where is an arbitrary constant of integration.
Thin filmA thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The controlled synthesis of materials as thin films (a process referred to as deposition) is a fundamental step in many applications. A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors, while more recently the metal layer is deposited using techniques such as sputtering.
Trigonometric substitutionIn mathematics, trigonometric substitution is the replacement of trigonometric functions for other expressions. In calculus, trigonometric substitution is a technique for evaluating integrals. Moreover, one may use the trigonometric identities to simplify certain integrals containing radical expressions. Like other methods of integration by substitution, when evaluating a definite integral, it may be simpler to completely deduce the antiderivative before applying the boundaries of integration.
PiezoelectricityPiezoelectricity (ˌpiːzoʊ-,_ˌpiːtsoʊ-,_paɪˌiːzoʊ-, piˌeɪzoʊ-,_piˌeɪtsoʊ-) is the electric charge that accumulates in certain solid materials—such as crystals, certain ceramics, and biological matter such as bone, DNA, and various proteins—in response to applied mechanical stress. The word piezoelectricity means electricity resulting from pressure and latent heat. It is derived (an ancient source of electric current). The piezoelectric effect results from the linear electromechanical interaction between the mechanical and electrical states in crystalline materials with no inversion symmetry.
Thin-film solar cellThin-film solar cells are made by depositing one or more thin layers (thin films or TFs) of photovoltaic material onto a substrate, such as glass, plastic or metal. Thin-film solar cells are typically a few nanometers (nm) to a few microns (μm) thick–much thinner than the wafers used in conventional crystalline silicon (c-Si) based solar cells, which can be up to 200 μm thick. Thin-film solar cells are commercially used in several technologies, including cadmium telluride (CdTe), copper indium gallium diselenide (CIGS), and amorphous thin-film silicon (a-Si, TF-Si).
CeramographyCeramography is the art and science of preparation, examination and evaluation of ceramic microstructures. Ceramography can be thought of as the metallography of ceramics. The microstructure is the structure level of approximately 0.1 to 100 μm, between the minimum wavelength of visible light and the resolution limit of the naked eye. The microstructure includes most grains, secondary phases, grain boundaries, pores, micro-cracks and hardness microindentations.
