Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
3D printing3D printing or additive manufacturing is the construction of a three-dimensional object from a CAD model or a digital 3D model. It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, with material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer. In the 1980s, 3D printing techniques were considered suitable only for the production of functional or aesthetic prototypes, and a more appropriate term for it at the time was rapid prototyping.
Graphics processing unitA graphics processing unit (GPU) is a specialized electronic circuit initially designed to accelerate computer graphics and (either on a video card or embedded on the motherboards, mobile phones, personal computers, workstations, and game consoles). After their initial design, GPUs were found to be useful for non-graphic calculations involving embarrassingly parallel problems due to their parallel structure. Other non-graphical uses include the training of neural networks and cryptocurrency mining.
Multi-core processorA multi-core processor is a microprocessor on a single integrated circuit with two or more separate processing units, called cores, each of which reads and executes program instructions. The instructions are ordinary CPU instructions (such as add, move data, and branch) but the single processor can run instructions on separate cores at the same time, increasing overall speed for programs that support multithreading or other parallel computing techniques.
Direct3DDirect3D is a graphics application programming interface (API) for Microsoft Windows. Part of DirectX, Direct3D is used to render three-dimensional graphics in applications where performance is important, such as games. Direct3D uses hardware acceleration if it is available on the graphics card, allowing for hardware acceleration of the entire 3D rendering pipeline or even only partial acceleration.
Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Cell (processor)Cell is a 64-bit multi-core microprocessor microarchitecture that combines a general-purpose PowerPC core of modest performance with streamlined coprocessing elements which greatly accelerate multimedia and vector processing applications, as well as many other forms of dedicated computation. It was developed by Sony, Toshiba, and IBM, an alliance known as "STI". The architectural design and first implementation were carried out at the STI Design Center in Austin, Texas over a four-year period beginning March 2001 on a budget reported by Sony as approaching US$400 million.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Vector processorIn computing, a vector processor or array processor is a central processing unit (CPU) that implements an instruction set where its instructions are designed to operate efficiently and effectively on large one-dimensional arrays of data called vectors. This is in contrast to scalar processors, whose instructions operate on single data items only, and in contrast to some of those same scalar processors having additional single instruction, multiple data (SIMD) or SWAR Arithmetic Units.
System on a chipA system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.
Network on a chipA network on a chip or network-on-chip (NoC ˌɛnˌoʊˈsiː or nɒk ) is a network-based communications subsystem on an integrated circuit ("microchip"), most typically between modules in a system on a chip (SoC). The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules.
Rent's ruleRent's rule pertains to the organization of computing logic, specifically the relationship between the number of external signal connections to a logic block (i.e., the number of "pins") with the number of logic gates in the logic block, and has been applied to circuits ranging from small digital circuits to mainframe computers. Put simply, it states that there is a simple power law relationship between these two values (pins and gates). In the 1960s, E. F.
SerializationIn computing, serialization (or serialisation) is the process of translating a data structure or object state into a format that can be stored (e.g. in secondary storage devices, data buffers in primary storage devices) or transmitted (e.g. data streams over computer networks) and reconstructed later (possibly in a different computer environment). When the resulting series of bits is reread according to the serialization format, it can be used to create a semantically identical clone of the original object.
Traffic congestionTraffic congestion is a condition in transport that is characterized by slower speeds, longer trip times, and increased vehicular queueing. Traffic congestion on urban road networks has increased substantially since the 1950s. When traffic demand is great enough that the interaction between vehicles slows the traffic stream, this results in congestion. While congestion is a possibility for any mode of transportation, this article will focus on automobile congestion on public roads.
3D scanning3D scanner is the process of analyzing a real-world object or environment to collect three dimensional data of its shape and possibly its appearance (e.g. color). The collected data can then be used to construct digital 3D models. A 3D scanner can be based on many different technologies, each with its own limitations, advantages and costs. Many limitations in the kind of objects that can be digitised are still present. For example, optical technology may encounter many difficulties with dark, shiny, reflective or transparent objects.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
EpycEpyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets. Epyc processors share the same microarchitecture as their regular desktop-grade counterparts, but have enterprise-grade features such as higher core counts, more PCI Express lanes, support for larger amounts of RAM, and larger cache memory.
OMAPThe OMAP (Open Multimedia Applications Platform) family, developed by Texas Instruments, was a series of /video processors. They are proprietary system on chips (SoCs) for portable and mobile multimedia applications. OMAP devices generally include a general-purpose ARM architecture processor core plus one or more specialized co-processors. Earlier OMAP variants commonly featured a variant of the Texas Instruments TMS320 series digital signal processor.
Computer clusterA computer cluster is a set of computers that work together so that they can be viewed as a single system. Unlike grid computers, computer clusters have each node set to perform the same task, controlled and scheduled by software. The components of a cluster are usually connected to each other through fast local area networks, with each node (computer used as a server) running its own instance of an operating system. In most circumstances, all of the nodes use the same hardware and the same operating system, although in some setups (e.
MicroprocessorA microprocessor is a computer processor where the data processing logic and control is included on a single integrated circuit (IC), or a small number of ICs. The microprocessor contains the arithmetic, logic, and control circuitry required to perform the functions of a computer's central processing unit (CPU). The IC is capable of interpreting and executing program instructions and performing arithmetic operations.
