Modified atmosphereModified atmosphere packaging (MAP) is the practice of modifying the composition of the internal atmosphere of a package (commonly food packages, drugs, etc.) in order to improve the shelf life. The need for this technology for food arises from the short shelf life of food products such as meat, fish, poultry, and dairy in the presence of oxygen. In food, oxygen is readily available for lipid oxidation reactions. Oxygen also helps maintain high respiration rates of fresh produce, which contribute to shortened shelf life.
Hermetic sealA hermetic seal is any type of sealing that makes a given object airtight (preventing the passage of air, oxygen, or other gases). The term originally applied to airtight glass containers, but as technology advanced it applied to a larger category of materials, including rubber and plastics. Hermetic seals are essential to the correct and safe functionality of many electronic and healthcare products. Used technically, it is stated in conjunction with a specific test method and conditions of use.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Wire bondingWire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.
Dual in-line packageIn microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits.
MEMSMEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.
Electrical connectorComponents of an electrical circuit are electrically connected if an electric current can run between them through an electrical conductor. An electrical connector is an electromechanical device used to create an electrical connection between parts of an electrical circuit, or between different electrical circuits, thereby joining them into a larger circuit. Most electrical connectors have a gender - i.e. the male component, called a plug, connects to the female component, or socket.
Semiconductor packageA semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure.
SolderingSoldering (USˈsɒdərɪŋ; UKˈsoʊldərɪŋ) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint. Soldering is commonly used in the electronics industry for the manufacture and repair of printed circuit boards (PCBs) and other electronic components. It is also used in plumbing and metalwork, as well as in the manufacture of jewelry and other decorative items.
Screen printingScreen printing is a printing technique where a mesh is used to transfer ink (or dye) onto a substrate, except in areas made impermeable to the ink by a blocking stencil. A blade or squeegee is moved across the screen to fill the open mesh apertures with ink, and a reverse stroke then causes the screen to touch the substrate momentarily along a line of contact. This causes the ink to wet the substrate and be pulled out of the mesh apertures as the screen springs back after the blade has passed.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Packaging and labelingPackaging is the science, art and technology of enclosing or protecting products for distribution, storage, sale, and use. Packaging also refers to the process of designing, evaluating, and producing packages. Packaging can be described as a coordinated system of preparing goods for transport, warehousing, logistics, sale, and end use. Packaging contains, protects, preserves, transports, informs, and sells. In many countries it is fully integrated into government, business, institutional, industrial, and personal use.
Planar transmission linePlanar transmission lines are transmission lines with conductors, or in some cases dielectric (insulating) strips, that are flat, ribbon-shaped lines. They are used to interconnect components on printed circuits and integrated circuits working at microwave frequencies because the planar type fits in well with the manufacturing methods for these components. Transmission lines are more than simply interconnections.
PrintingPrinting is a process for mass reproducing text and images using a master form or template. The earliest non-paper products involving printing include cylinder seals and objects such as the Cyrus Cylinder and the Cylinders of Nabonidus. The earliest known form of printing as applied to paper was woodblock printing, which appeared in China before 220 AD for cloth printing. However, it would not be applied to paper until the seventh century.
Electrical networkAn electrical network is an interconnection of electrical components (e.g., batteries, resistors, inductors, capacitors, switches, transistors) or a model of such an interconnection, consisting of electrical elements (e.g., voltage sources, current sources, resistances, inductances, capacitances). An electrical circuit is a network consisting of a closed loop, giving a return path for the current. Thus all circuits are networks, but not all networks are circuits (although networks without a closed loop are often imprecisely referred to as "circuits").
Package managerA package manager or package-management system is a collection of software tools that automates the process of installing, upgrading, configuring, and removing computer programs for a computer in a consistent manner. A package manager deals with packages, distributions of software and data in s. Packages contain metadata, such as the software's name, description of its purpose, version number, vendor, checksum (preferably a cryptographic hash function), and a list of dependencies necessary for the software to run properly.
Anti-reflective coatingAn antireflective, antiglare or anti-reflection (AR) coating is a type of optical coating applied to the surface of lenses, other optical elements, and photovoltaic cells to reduce reflection. In typical imaging systems, this improves the efficiency since less light is lost due to reflection. In complex systems such as cameras, binoculars, telescopes, and microscopes the reduction in reflections also improves the contrast of the image by elimination of stray light. This is especially important in planetary astronomy.
Printed circuit boardA printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
Atmosphere of MarsThe atmosphere of Mars is the layer of gases surrounding Mars. It is primarily composed of carbon dioxide (95%), molecular nitrogen (2.8%), and argon (2%). It also contains trace levels of water vapor, oxygen, carbon monoxide, hydrogen, and noble gases. The atmosphere of Mars is much thinner than Earth's. The average surface pressure is only about which is less than 1% of the Earth's value. The currently thin Martian atmosphere prohibits the existence of liquid water on the surface of Mars, but many studies suggest that the Martian atmosphere was much thicker in the past.
Ground (electricity)In electrical engineering, ground or earth may be a reference point in an electrical circuit from which voltages are measured, a common return path for electric current, or a direct physical connection to the Earth. Electrical circuits may be connected to ground for several reasons. Exposed conductive parts of electrical equipment are connected to ground, to protect users from electrical shock hazard. If internal insulation fails, dangerous voltages may appear on the exposed conductive parts.
