Chemical vapor depositionChemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.
Evaporation (deposition)Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film. Evaporation involves two basic processes: a hot source material evaporates and condenses on the substrate. It resembles the familiar process by which liquid water appears on the lid of a boiling pot.
Pulsed laser depositionPulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
Physical vapor depositionPhysical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.
Vacuum depositionVacuum deposition , also known as vacuum coating or thin-film deposition, is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings.
Atomic layer depositionAtomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors.
Plasma-facing materialIn nuclear fusion power research, the plasma-facing material (or materials) (PFM) is any material used to construct the plasma-facing components (PFC), those components exposed to the plasma within which nuclear fusion occurs, and particularly the material used for the lining the first wall or divertor region of the reactor vessel. Plasma-facing materials for fusion reactor designs must support the overall steps for energy generation, these include: Generating heat through fusion, Capturing heat in the first wall, Transferring heat at a faster rate than capturing heat.
Thin filmA thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The controlled synthesis of materials as thin films (a process referred to as deposition) is a fundamental step in many applications. A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors, while more recently the metal layer is deposited using techniques such as sputtering.
Enriched uraniumEnriched uranium is a type of uranium in which the percent composition of uranium-235 (written 235U) has been increased through the process of isotope separation. Naturally occurring uranium is composed of three major isotopes: uranium-238 (238U with 99.2739–99.2752% natural abundance), uranium-235 (235U, 0.7198–0.7202%), and uranium-234 (234U, 0.0050–0.0059%). 235U is the only nuclide existing in nature (in any appreciable amount) that is fissile with thermal neutrons.
Joint European TorusThe Joint European Torus, or JET, is an operational magnetically confined plasma physics experiment, located at Culham Centre for Fusion Energy in Oxfordshire, UK. Based on a tokamak design, the fusion research facility is a joint European project with a main purpose of opening the way to future nuclear fusion grid energy. At the time of its design JET was larger than any comparable machine. JET was built with the hope of reaching scientific breakeven where the fusion energy gain factor Q =1.0.
Plasma-enhanced chemical vapor depositionPlasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.
Isotope separationIsotope separation is the process of concentrating specific isotopes of a chemical element by removing other isotopes. The use of the nuclides produced is varied. The largest variety is used in research (e.g. in chemistry where atoms of "marker" nuclide are used to figure out reaction mechanisms). By tonnage, separating natural uranium into enriched uranium and depleted uranium is the largest application. In the following text, mainly uranium enrichment is considered.
Characteristic X-rayCharacteristic X-rays are emitted when outer-shell electrons fill a vacancy in the inner shell of an atom, releasing X-rays in a pattern that is "characteristic" to each element. Characteristic X-rays were discovered by Charles Glover Barkla in 1909, who later won the Nobel Prize in Physics for his discovery in 1917. Characteristic X-rays are produced when an element is bombarded with high-energy particles, which can be photons, electrons or ions (such as protons).
X-ray fluorescenceX-ray fluorescence (XRF) is the emission of characteristic "secondary" (or fluorescent) X-rays from a material that has been excited by being bombarded with high-energy X-rays or gamma rays. The phenomenon is widely used for elemental analysis and chemical analysis, particularly in the investigation of metals, glass, ceramics and building materials, and for research in geochemistry, forensic science, archaeology and art objects such as paintings.
Zippe-type centrifugeThe Zippe-type centrifuge is a gas centrifuge designed to enrich the rare fissile isotope uranium-235 (235U) from the mixture of isotopes found in naturally occurring uranium compounds. The isotopic separation is based on the slight difference in mass of the isotopes. The Zippe design was originally developed in the Soviet Union by a team led by 60 Austrian and German scientists and engineers captured after World War II, working in detention.
