Scattering parametersScattering parameters or S-parameters (the elements of a scattering matrix or S-matrix) describe the electrical behavior of linear electrical networks when undergoing various steady state stimuli by electrical signals. The parameters are useful for several branches of electrical engineering, including electronics, communication systems design, and especially for microwave engineering. The S-parameters are members of a family of similar parameters, other examples being: Y-parameters, Z-parameters, H-parameters, T-parameters or ABCD-parameters.
Strength of materialsThe field of strength of materials (also called mechanics of materials) typically refers to various methods of calculating the stresses and strains in structural members, such as beams, columns, and shafts. The methods employed to predict the response of a structure under loading and its susceptibility to various failure modes takes into account the properties of the materials such as its yield strength, ultimate strength, Young's modulus, and Poisson's ratio.
Ultimate tensile strengthUltimate tensile strength (also called UTS, tensile strength, TS, ultimate strength or in notation) is the maximum stress that a material can withstand while being stretched or pulled before breaking. In brittle materials the ultimate tensile strength is close to the yield point, whereas in ductile materials the ultimate tensile strength can be higher. The ultimate tensile strength is usually found by performing a tensile test and recording the engineering stress versus strain.
Impedance parametersImpedance parameters or Z-parameters (the elements of an impedance matrix or Z-matrix) are properties used in electrical engineering, electronic engineering, and communication systems engineering to describe the electrical behavior of linear electrical networks. They are also used to describe the small-signal (linearized) response of non-linear networks. They are members of a family of similar parameters used in electronic engineering, other examples being: S-parameters, Y-parameters, H-parameters, T-parameters or ABCD-parameters.
Admittance parametersAdmittance parameters or Y-parameters (the elements of an admittance matrix or Y-matrix) are properties used in many areas of electrical engineering, such as power, electronics, and telecommunications. These parameters are used to describe the electrical behavior of linear electrical networks. They are also used to describe the small-signal (linearized) response of non-linear networks. Y parameters are also known as short circuited admittance parameters.
Compressive strengthIn mechanics, compressive strength (or compression strength) is the capacity of a material or structure to withstand loads tending to reduce size (as opposed to tensile strength which withstands loads tending to elongate). In other words, compressive strength resists compression (being pushed together), whereas tensile strength resists tension (being pulled apart). In the study of strength of materials, tensile strength, compressive strength, and shear strength can be analyzed independently.
Shear strengthIn engineering, shear strength is the strength of a material or component against the type of yield or structural failure when the material or component fails in shear. A shear load is a force that tends to produce a sliding failure on a material along a plane that is parallel to the direction of the force. When a paper is cut with scissors, the paper fails in shear. In structural and mechanical engineering, the shear strength of a component is important for designing the dimensions and materials to be used for the manufacture or construction of the component (e.
Specific strengthThe specific strength is a material's (or muscle's) strength (force per unit area at failure) divided by its density. It is also known as the strength-to-weight ratio or strength/weight ratio or strength-to-mass ratio. In fiber or textile applications, tenacity is the usual measure of specific strength. The SI unit for specific strength is Pa⋅m3/kg, or N⋅m/kg, which is dimensionally equivalent to m2/s2, though the latter form is rarely used.
Two-port networkIn electronics, a two-port network (a kind of four-terminal network or quadripole) is an electrical network (i.e. a circuit) or device with two pairs of terminals to connect to external circuits. Two terminals constitute a port if the currents applied to them satisfy the essential requirement known as the port condition: the current entering one terminal must equal the current emerging from the other terminal on the same port. The ports constitute interfaces where the network connects to other networks, the points where signals are applied or outputs are taken.
Composite materialA composite material (also called a composition material or shortened to composite, which is the common name) is a material which is produced from two or more constituent materials. These constituent materials have notably dissimilar chemical or physical properties and are merged to create a material with properties unlike the individual elements. Within the finished structure, the individual elements remain separate and distinct, distinguishing composites from mixtures and solid solutions.
Critical exponentCritical exponents describe the behavior of physical quantities near continuous phase transitions. It is believed, though not proven, that they are universal, i.e. they do not depend on the details of the physical system, but only on some of its general features. For instance, for ferromagnetic systems, the critical exponents depend only on: the dimension of the system the range of the interaction the spin dimension These properties of critical exponents are supported by experimental data.
Surface tensionSurface tension is the tendency of liquid surfaces at rest to shrink into the minimum surface area possible. Surface tension is what allows objects with a higher density than water such as razor blades and insects (e.g. water striders) to float on a water surface without becoming even partly submerged. At liquid–air interfaces, surface tension results from the greater attraction of liquid molecules to each other (due to cohesion) than to the molecules in the air (due to adhesion). There are two primary mechanisms in play.
Surface energyIn surface science, surface free energy (also interfacial free energy or surface energy) quantifies the disruption of intermolecular bonds that occurs when a surface is created. In solid-state physics, surfaces must be intrinsically less energetically favorable than the bulk of the material (the atoms on the surface have more energy compared with the atoms in the bulk), otherwise there would be a driving force for surfaces to be created, removing the bulk of the material (see sublimation).
Finite element methodThe finite element method (FEM) is a popular method for numerically solving differential equations arising in engineering and mathematical modeling. Typical problem areas of interest include the traditional fields of structural analysis, heat transfer, fluid flow, mass transport, and electromagnetic potential. The FEM is a general numerical method for solving partial differential equations in two or three space variables (i.e., some boundary value problems).
Critical phenomenaIn physics, critical phenomena is the collective name associated with the physics of critical points. Most of them stem from the divergence of the correlation length, but also the dynamics slows down. Critical phenomena include scaling relations among different quantities, power-law divergences of some quantities (such as the magnetic susceptibility in the ferromagnetic phase transition) described by critical exponents, universality, fractal behaviour, and ergodicity breaking.
Scale invarianceIn physics, mathematics and statistics, scale invariance is a feature of objects or laws that do not change if scales of length, energy, or other variables, are multiplied by a common factor, and thus represent a universality. The technical term for this transformation is a dilatation (also known as dilation). Dilatations can form part of a larger conformal symmetry. In mathematics, scale invariance usually refers to an invariance of individual functions or curves.
Boundary element methodThe boundary element method (BEM) is a numerical computational method of solving linear partial differential equations which have been formulated as integral equations (i.e. in boundary integral form), including fluid mechanics, acoustics, electromagnetics (where the technique is known as method of moments or abbreviated as MoM), fracture mechanics, and contact mechanics. The integral equation may be regarded as an exact solution of the governing partial differential equation.
WearWear is the damaging, gradual removal or deformation of material at solid surfaces. Causes of wear can be mechanical (e.g., erosion) or chemical (e.g., corrosion). The study of wear and related processes is referred to as tribology. Wear in machine elements, together with other processes such as fatigue and creep, causes functional surfaces to degrade, eventually leading to material failure or loss of functionality. Thus, wear has large economic relevance as first outlined in the Jost Report.
Boundary layerIn physics and fluid mechanics, a boundary layer is the thin layer of fluid in the immediate vicinity of a bounding surface formed by the fluid flowing along the surface. The fluid's interaction with the wall induces a no-slip boundary condition (zero velocity at the wall). The flow velocity then monotonically increases above the surface until it returns to the bulk flow velocity. The thin layer consisting of fluid whose velocity has not yet returned to the bulk flow velocity is called the velocity boundary layer.
Surface scienceSurface science is the study of physical and chemical phenomena that occur at the interface of two phases, including solid–liquid interfaces, solid–gas interfaces, solid–vacuum interfaces, and liquid–gas interfaces. It includes the fields of surface chemistry and surface physics. Some related practical applications are classed as surface engineering. The science encompasses concepts such as heterogeneous catalysis, semiconductor device fabrication, fuel cells, self-assembled monolayers, and adhesives.
