Computer coolingComputer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling.
Parallel computingParallel computing is a type of computation in which many calculations or processes are carried out simultaneously. Large problems can often be divided into smaller ones, which can then be solved at the same time. There are several different forms of parallel computing: bit-level, instruction-level, data, and task parallelism. Parallelism has long been employed in high-performance computing, but has gained broader interest due to the physical constraints preventing frequency scaling.
CPU cacheA CPU cache is a hardware cache used by the central processing unit (CPU) of a computer to reduce the average cost (time or energy) to access data from the main memory. A cache is a smaller, faster memory, located closer to a processor core, which stores copies of the data from frequently used main memory locations. Most CPUs have a hierarchy of multiple cache levels (L1, L2, often L3, and rarely even L4), with different instruction-specific and data-specific caches at level 1.
Thermal management (electronics)All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
Heat pipeA heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces. At the hot interface of a heat pipe, a volatile liquid in contact with a thermally conductive solid surface turns into a vapor by absorbing heat from that surface. The vapor then travels along the heat pipe to the cold interface and condenses back into a liquid, releasing the latent heat. The liquid then returns to the hot interface through capillary action, centrifugal force, or gravity and the cycle repeats.
MicroprocessorA microprocessor is a computer processor where the data processing logic and control is included on a single integrated circuit (IC), or a small number of ICs. The microprocessor contains the arithmetic, logic, and control circuitry required to perform the functions of a computer's central processing unit (CPU). The IC is capable of interpreting and executing program instructions and performing arithmetic operations.
Processor registerA processor register is a quickly accessible location available to a computer's processor. Registers usually consist of a small amount of fast storage, although some registers have specific hardware functions, and may be read-only or write-only. In computer architecture, registers are typically addressed by mechanisms other than main memory, but may in some cases be assigned a memory address e.g. DEC PDP-10, ICT 1900.
System on a chipA system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.
Critical heat fluxIn the study of heat transfer, critical heat flux (CHF) is the heat flux at which boiling ceases to be an effective form of transferring heat from a solid surface to a liquid. Boiling systems are those in which liquid coolant absorbs energy from a heated solid surface and undergoes a change in phase. In flow boiling systems, the saturated fluid progresses through a series of flow regimes as vapor quality is increased. In systems that utilize boiling, the heat transfer rate is significantly higher than if the fluid were a single phase (i.
Water coolingWater cooling is a method of heat removal from components and industrial equipment. Evaporative cooling using water is often more efficient than air cooling. Water is inexpensive and non-toxic; however, it can contain impurities and cause corrosion. Water cooling is commonly used for cooling automobile internal combustion engines and power stations. Water coolers utilising convective heat transfer are used inside high-end personal computers to lower the temperature of CPUs and other components.
XeonXeon (ˈziːɒn ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, more PCI Express lanes, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture.
Mass fluxIn physics and engineering, mass flux is the rate of mass flow. Its SI units are kg m−2 s−1. The common symbols are j, J, q, Q, φ, or Φ (Greek lower or capital Phi), sometimes with subscript m to indicate mass is the flowing quantity. Mass flux can also refer to an alternate form of flux in Fick's law that includes the molecular mass, or in Darcy's law that includes the mass density. Sometimes the defining equation for mass flux in this article is used interchangeably with the defining equation in mass flow rate.
Superscalar processorA superscalar processor is a CPU that implements a form of parallelism called instruction-level parallelism within a single processor. In contrast to a scalar processor, which can execute at most one single instruction per clock cycle, a superscalar processor can execute more than one instruction during a clock cycle by simultaneously dispatching multiple instructions to different execution units on the processor. It therefore allows more throughput (the number of instructions that can be executed in a unit of time) than would otherwise be possible at a given clock rate.
Radiator (engine cooling)Radiators are heat exchangers used for cooling internal combustion engines, mainly in automobiles but also in piston-engined aircraft, railway locomotives, motorcycles, stationary generating plant or any similar use of such an engine. Internal combustion engines are often cooled by circulating a liquid called engine coolant through the engine block, and cylinder head where it is heated, then through a radiator where it loses heat to the atmosphere, and then returned to the engine.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Heat pump and refrigeration cycleThermodynamic heat pump cycles or refrigeration cycles are the conceptual and mathematical models for heat pump, air conditioning and refrigeration systems. A heat pump is a mechanical system that allows for the transmission of heat from one location (the "source") at a lower temperature to another location (the "sink" or "heat sink") at a higher temperature. Thus a heat pump may be thought of as a "heater" if the objective is to warm the heat sink (as when warming the inside of a home on a cold day), or a "refrigerator" or “cooler” if the objective is to cool the heat source (as in the normal operation of a freezer).
Working fluidFor fluid power, a working fluid is a gas or liquid that primarily transfers force, motion, or mechanical energy. In hydraulics, water or hydraulic fluid transfers force between hydraulic components such as hydraulic pumps, hydraulic cylinders, and hydraulic motors that are assembled into hydraulic machinery, hydraulic drive systems, etc. In pneumatics, the working fluid is air or another gas which transfers force between pneumatic components such as compressors, vacuum pumps, pneumatic cylinders, and pneumatic motors.
Chip carrierIn electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large. Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is "flat pack".
Pumpable ice technologyPumpable ice technology (PIT) uses thin liquids, with the cooling capacity of ice. Pumpable ice is typically a slurry of ice crystals or particles ranging from 5 micrometers to 1 cm in diameter and transported in brine, seawater, food liquid, or gas bubbles of air, ozone, or carbon dioxide. Beyond generic terms, such as pumpable, jelly, or slurry ice, there are many trademark names for such coolant, like "Deepchill", “Beluga”, “optim”, “flow”, “fluid”, “jel”, “binary”, “liquid”, “maxim”, “whipped”, and “bubble slurry” ice.
Mass flow rateIn physics and engineering, mass flow rate is the mass of a substance which passes per unit of time. Its unit is kilogram per second in SI units, and slug per second or pound per second in US customary units. The common symbol is (ṁ, pronounced "m-dot"), although sometimes μ (Greek lowercase mu) is used. Sometimes, mass flow rate is termed mass flux or mass current, see for example Schaum's Outline of Fluid Mechanics. In this article, the (more intuitive) definition is used. Mass flow rate is defined by the limit: i.
