NanowireA nanowire is a nanostructure in the form of a wire with the diameter of the order of a nanometre (10−9 metres). More generally, nanowires can be defined as structures that have a thickness or diameter constrained to tens of nanometers or less and an unconstrained length. At these scales, quantum mechanical effects are important—which coined the term "quantum wires". Many different types of nanowires exist, including superconducting (e.g. YBCO), metallic (e.g. Ni, Pt, Au, Ag), semiconducting (e.g.
Metamaterial cloakingMetamaterial cloaking is the usage of metamaterials in an invisibility cloak. This is accomplished by manipulating the paths traversed by light through a novel optical material. Metamaterials direct and control the propagation and transmission of specified parts of the light spectrum and demonstrate the potential to render an object seemingly invisible. Metamaterial cloaking, based on transformation optics, describes the process of shielding something from view by controlling electromagnetic radiation.
Tunable metamaterialA tunable metamaterial is a metamaterial with a variable response to an incident electromagnetic wave. This includes remotely controlling how an incident electromagnetic wave (EM wave) interacts with a metamaterial. This translates into the capability to determine whether the EM wave is transmitted, reflected, or absorbed. In general, the lattice structure of the tunable metamaterial is adjustable in real time, making it possible to reconfigure a metamaterial device during operation.
Terahertz metamaterialA terahertz metamaterial is a class of composite metamaterials designed to interact at terahertz (THz) frequencies. The terahertz frequency range used in materials research is usually defined as 0.1 to 10 THz. This bandwidth is also known as the terahertz gap because it is noticeably underutilized. This is because terahertz waves are electromagnetic waves with frequencies higher than microwaves but lower than infrared radiation and visible light.
Metamaterial antennaMetamaterial antennas are a class of antennas which use metamaterials to increase performance of miniaturized (electrically small) antenna systems. Their purpose, as with any electromagnetic antenna, is to launch energy into free space. However, this class of antenna incorporates metamaterials, which are materials engineered with novel, often microscopic, structures to produce unusual physical properties. Antenna designs incorporating metamaterials can step-up the antenna's radiated power.
Acoustic metamaterialAn acoustic metamaterial, sonic crystal, or phononic crystal is a material designed to control, direct, and manipulate sound waves or phonons in gases, liquids, and solids (crystal lattices). Sound wave control is accomplished through manipulating parameters such as the bulk modulus β, density ρ, and chirality. They can be engineered to either transmit, or trap and amplify sound waves at certain frequencies. In the latter case, the material is an acoustic resonator.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Thin-film solar cellThin-film solar cells are made by depositing one or more thin layers (thin films or TFs) of photovoltaic material onto a substrate, such as glass, plastic or metal. Thin-film solar cells are typically a few nanometers (nm) to a few microns (μm) thick–much thinner than the wafers used in conventional crystalline silicon (c-Si) based solar cells, which can be up to 200 μm thick. Thin-film solar cells are commercially used in several technologies, including cadmium telluride (CdTe), copper indium gallium diselenide (CIGS), and amorphous thin-film silicon (a-Si, TF-Si).
Transformation opticsTransformation optics is a branch of optics which applies metamaterials to produce spatial variations, derived from coordinate transformations, which can direct chosen bandwidths of electromagnetic radiation. This can allow for the construction of new composite artificial devices, which probably could not exist without metamaterials and coordinate transformation. Computing power that became available in the late 1990s enables prescribed quantitative values for the permittivity and permeability, the constitutive parameters, which produce localized spatial variations.
SuperlensA superlens, or super lens, is a lens which uses metamaterials to go beyond the diffraction limit. The diffraction limit is a feature of conventional lenses and microscopes that limits the fineness of their resolution depending on the illumination wavelength and the numerical aperture NA of the objective lens. Many lens designs have been proposed that go beyond the diffraction limit in some way, but constraints and obstacles face each of them. In 1873 Ernst Abbe reported that conventional lenses are incapable of capturing some fine details of any given image.
NanophotonicsNanophotonics or nano-optics is the study of the behavior of light on the nanometer scale, and of the interaction of nanometer-scale objects with light. It is a branch of optics, optical engineering, electrical engineering, and nanotechnology. It often involves dielectric structures such as nanoantennas, or metallic components, which can transport and focus light via surface plasmon polaritons. The term "nano-optics", just like the term "optics", usually refers to situations involving ultraviolet, visible, and near-infrared light (free-space wavelengths from 300 to 1200 nanometers).
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Molecular-beam epitaxyMolecular-beam epitaxy (MBE) is an epitaxy method for thin-film deposition of single crystals. MBE is widely used in the manufacture of semiconductor devices, including transistors, and it is considered one of the fundamental tools for the development of nanotechnologies. MBE is used to fabricate diodes and MOSFETs (MOS field-effect transistors) at microwave frequencies, and to manufacture the lasers used to read optical discs (such as CDs and DVDs). Original ideas of MBE process were first established by K.
Solar cellA solar cell, or photovoltaic cell, is an electronic device that converts the energy of light directly into electricity by the photovoltaic effect, which is a physical phenomenon. It is a form of photoelectric cell, defined as a device whose electrical characteristics, such as current, voltage, or resistance, vary when exposed to light. Individual solar cell devices are often the electrical building blocks of photovoltaic modules, known colloquially as solar panels.
Aspect ratioThe aspect ratio of a geometric shape is the ratio of its sizes in different dimensions. For example, the aspect ratio of a rectangle is the ratio of its longer side to its shorter side—the ratio of width to height, when the rectangle is oriented as a "landscape". The aspect ratio is most often expressed as two integer numbers separated by a colon (x:y), less commonly as a simple or decimal fraction. The values x and y do not represent actual widths and heights but, rather, the proportion between width and height.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Aspect ratio (image)The aspect ratio of an image is the ratio of its width to its height, and is expressed with two numbers separated by a colon, such as 16:9, sixteen-to-nine. For the x:y aspect ratio, the image is x units wide and y units high. Common aspect ratios are 1.85:1 and 2.39:1 in cinematography, 4:3 and 16:9 in television photography, and 3:2 in still photography. The common film aspect ratios used in cinemas are 1.85:1 and 2.39:1. Two common videographic aspect ratios are 4:3 (1.:1), the universal video format of the 20th century, and 16:9 (1.
Multi-project wafer serviceMulti-project chip (MPC), and multi-project wafer (MPW) semiconductor manufacturing arrangements allow customers to share mask and microelectronics wafer fabrication cost between several designs or projects. With the MPC arrangement, one chip is a combination of several designs and this combined chip is then repeated all over the wafer during the manufacturing. MPC arrangement produces typically roughly equal number of chip designs per wafer.
3D modelingIn 3D computer graphics, 3D modeling is the process of developing a mathematical coordinate-based representation of any surface of an object (inanimate or living) in three dimensions via specialized software by manipulating edges, vertices, and polygons in a simulated 3D space. Three-dimensional (3D) models represent a physical body using a collection of points in 3D space, connected by various geometric entities such as triangles, lines, curved surfaces, etc.
Wafer (electronics)In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning.
