Publication

Reliability Analysis of Lead-free Solders

John Botsis, Joël Cugnoni
2008
Conference Papers

Abstract

In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have been validated with a thermal shock test. An 0805 resistor has been considered to simulate creep deformation, an electronic board has been used for a thermal shock test to check continuity of the circuit for the specified mission, and finally a detailed metallographic study has been performed. Main constitutive relations have been implemented in a commercial finite-element analysis software (ABAQUS 6.5), to predict creep strain accumulation under thermal loads. Effects of implementing different constitutive relations in compare with life prediction models have been investigated. Overall, both solders are highly reliable with this number of thermal cycles; however, SnAgCu shows higher life time under this type of loading.

Official source

https://infoscience.epfl.ch/entities/publication/dcd29c9b-fd04-435a-b042-ce84458e5125

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John Botsis, Joël Cugnoni
2008
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/dcd29c9b-fd04-435a-b042-ce84458e5125

About this result

Related concepts (18)

Solder

Solder (UKˈsɒldə,_ˈsəʊldə; NA: ˈsɒdər) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.

Soldering

Soldering (USˈsɒdərɪŋ; UKˈsoʊldərɪŋ) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint. Soldering is commonly used in the electronics industry for the manufacture and repair of printed circuit boards (PCBs) and other electronic components. It is also used in plumbing and metalwork, as well as in the manufacture of jewelry and other decorative items.

Creep (deformation)

In materials science, creep (sometimes called cold flow) is the tendency of a solid material to undergo slow deformation while subject to persistent mechanical stresses. It can occur as a result of long-term exposure to high levels of stress that are still below the yield strength of the material. Creep is more severe in materials that are subjected to heat for long periods and generally increase as they near their melting point. The rate of deformation is a function of the material's properties, exposure time, exposure temperature and the applied structural load.

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