Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Electrical impedanceIn electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit. Quantitatively, the impedance of a two-terminal circuit element is the ratio of the complex representation of the sinusoidal voltage between its terminals, to the complex representation of the current flowing through it. In general, it depends upon the frequency of the sinusoidal voltage.
Current sensingIn electrical engineering, current sensing is any one of several techniques used to measure electric current. The measurement of current ranges from picoamps to tens of thousands of amperes. The selection of a current sensing method depends on requirements such as magnitude, accuracy, bandwidth, robustness, cost, isolation or size. The current value may be directly displayed by an instrument, or converted to digital form for use by a monitoring or control system.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
IntegratorAn integrator in measurement and control applications is an element whose output signal is the time integral of its input signal. It accumulates the input quantity over a defined time to produce a representative output. Integration is an important part of many engineering and scientific applications. Mechanical integrators are the oldest type and are still used for metering water flow or electrical power. Electronic analogue integrators are the basis of analog computers and charge amplifiers.
RC circuitA resistor–capacitor circuit (RC circuit), or RC filter or RC network, is an electric circuit composed of resistors and capacitors. It may be driven by a voltage or current source and these will produce different responses. A first order RC circuit is composed of one resistor and one capacitor and is the simplest type of RC circuit. RC circuits can be used to filter a signal by blocking certain frequencies and passing others.
Dual in-line packageIn microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits.
System in a packageA system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc.
Current sourceA current source is an electronic circuit that delivers or absorbs an electric current which is independent of the voltage across it. A current source is the dual of a voltage source. The term current sink is sometimes used for sources fed from a negative voltage supply. Figure 1 shows the schematic symbol for an ideal current source driving a resistive load. There are two types. An independent current source (or sink) delivers a constant current. A dependent current source delivers a current which is proportional to some other voltage or current in the circuit.
Package on a packagePackage on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
Decoupling capacitorIn electronics, a decoupling capacitor is a capacitor used to decouple (i.e. prevent electrical energy from transferring to) one part of a circuit from another. Noise caused by other circuit elements is shunted through the capacitor, reducing its effect on the rest of the circuit. For higher frequencies, an alternative name is bypass capacitor as it is used to bypass the power supply or other high-impedance component of a circuit. Active devices of an electronic system (e.g.
RL circuitA resistor–inductor circuit (RL circuit), or RL filter or RL network, is an electric circuit composed of resistors and inductors driven by a voltage or current source. A first-order RL circuit is composed of one resistor and one inductor, either in series driven by a voltage source or in parallel driven by a current source. It is one of the simplest analogue infinite impulse response electronic filters. The fundamental passive linear circuit elements are the resistor (R), capacitor (C) and inductor (L).
Electrical networkAn electrical network is an interconnection of electrical components (e.g., batteries, resistors, inductors, capacitors, switches, transistors) or a model of such an interconnection, consisting of electrical elements (e.g., voltage sources, current sources, resistances, inductances, capacitances). An electrical circuit is a network consisting of a closed loop, giving a return path for the current. Thus all circuits are networks, but not all networks are circuits (although networks without a closed loop are often imprecisely referred to as "circuits").
Film capacitorFilm capacitors, plastic film capacitors, film dielectric capacitors, or polymer film capacitors, generically called film caps as well as power film capacitors, are electrical capacitors with an insulating plastic film as the dielectric, sometimes combined with paper as carrier of the electrodes. The dielectric films, depending on the desired dielectric strength, are drawn in a special process to an extremely thin thickness, and are then provided with electrodes.
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Reference electrodeA reference electrode is an electrode that has a stable and well-known electrode potential. The overall chemical reaction taking place in a cell is made up of two independent half-reactions, which describe chemical changes at the two electrodes. To focus on the reaction at the working electrode, the reference electrode is standardized with constant (buffered or saturated) concentrations of each participant of the redox reaction. There are many ways reference electrodes are used.
Linear circuitA linear circuit is an electronic circuit which obeys the superposition principle. This means that the output of the circuit F(x) when a linear combination of signals ax1(t) + bx2(t) is applied to it is equal to the linear combination of the outputs due to the signals x1(t) and x2(t) applied separately: It is called a linear circuit because the output voltage and current of such a circuit are linear functions of its input voltage and current. This kind of linearity is not the same as that of straight-line graphs.
CapacitorA capacitor is a device that stores electrical energy in an electric field by accumulating electric charges on two closely spaced surfaces that are insulated from each other. It is a passive electronic component with two terminals. The effect of a capacitor is known as capacitance. While some capacitance exists between any two electrical conductors in proximity in a circuit, a capacitor is a component designed to add capacitance to a circuit.
Electrical lengthIn electrical engineering, electrical length is a dimensionless parameter equal to the physical length of an electrical conductor such as a cable or wire, divided by the wavelength of alternating current at a given frequency traveling through the conductor. In other words, it is the length of the conductor measured in wavelengths. It can alternately be expressed as an angle, in radians or degrees, equal to the phase shift the alternating current experiences traveling through the conductor.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
