CantileverA cantilever is a rigid structural element that extends horizontally and is supported at only one end. Typically it extends from a flat vertical surface such as a wall, to which it must be firmly attached. Like other structural elements, a cantilever can be formed as a beam, plate, truss, or slab. When subjected to a structural load at its far, unsupported end, the cantilever carries the load to the support where it applies a shear stress and a bending moment. Cantilever construction allows overhanging structures without additional support.
Atomic force microscopyAtomic force microscopy (AFM) or scanning force microscopy (SFM) is a very-high-resolution type of scanning probe microscopy (SPM), with demonstrated resolution on the order of fractions of a nanometer, more than 1000 times better than the optical diffraction limit. Atomic force microscopy (AFM) is a type of scanning probe microscopy (SPM), with demonstrated resolution on the order of fractions of a nanometer, more than 1000 times better than the optical diffraction limit.
BendingIn applied mechanics, bending (also known as flexure) characterizes the behavior of a slender structural element subjected to an external load applied perpendicularly to a longitudinal axis of the element. The structural element is assumed to be such that at least one of its dimensions is a small fraction, typically 1/10 or less, of the other two. When the length is considerably longer than the width and the thickness, the element is called a beam.
Deflection (engineering)In structural engineering, deflection is the degree to which a part of a structural element is displaced under a load (because it deforms). It may refer to an angle or a distance. The deflection distance of a member under a load can be calculated by integrating the function that mathematically describes the slope of the deflected shape of the member under that load. Standard formulas exist for the deflection of common beam configurations and load cases at discrete locations.
SolderingSoldering (USˈsɒdərɪŋ; UKˈsoʊldərɪŋ) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint. Soldering is commonly used in the electronics industry for the manufacture and repair of printed circuit boards (PCBs) and other electronic components. It is also used in plumbing and metalwork, as well as in the manufacture of jewelry and other decorative items.
TrussA truss is an assembly of members such as beams, connected by nodes, that creates a rigid structure. In engineering, a truss is a structure that "consists of two-force members only, where the members are organized so that the assemblage as a whole behaves as a single object". A "two-force member" is a structural component where force is applied to only two points. Although this rigorous definition allows the members to have any shape connected in any stable configuration, trusses typically comprise five or more triangular units constructed with straight members whose ends are connected at joints referred to as nodes.
SolderSolder (UKˈsɒldə,_ˈsəʊldə; NA: ˈsɒdər) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Circuit designThe process of circuit design can cover systems ranging from complex electronic systems down to the individual transistors within an integrated circuit. One person can often do the design process without needing a planned or structured design process for simple circuits. Still, teams of designers following a systematic approach with intelligently guided computer simulation are becoming increasingly common for more complex designs.
SensorA sensor is a device that produces an output signal for the purpose of sensing a physical phenomenon. In the broadest definition, a sensor is a device, module, machine, or subsystem that detects events or changes in its environment and sends the information to other electronics, frequently a computer processor. Sensors are used in everyday objects such as touch-sensitive elevator buttons (tactile sensor) and lamps which dim or brighten by touching the base, and in innumerable applications of which most people are never aware.
MagnetometerA magnetometer is a device that measures magnetic field or magnetic dipole moment. Different types of magnetometers measure the direction, strength, or relative change of a magnetic field at a particular location. A compass is one such device, one that measures the direction of an ambient magnetic field, in this case, the Earth's magnetic field. Other magnetometers measure the magnetic dipole moment of a magnetic material such as a ferromagnet, for example by recording the effect of this magnetic dipole on the induced current in a coil.
Integrated circuit designIntegrated circuit design, or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography. IC design can be divided into the broad categories of digital and analog IC design. Digital IC design is to produce components such as microprocessors, FPGAs, memories (RAM, ROM, and flash) and digital ASICs.
Processor designProcessor design is a subfield of computer science and computer engineering (fabrication) that deals with creating a processor, a key component of computer hardware. The design process involves choosing an instruction set and a certain execution paradigm (e.g. VLIW or RISC) and results in a microarchitecture, which might be described in e.g. VHDL or Verilog. For microprocessor design, this description is then manufactured employing some of the various semiconductor device fabrication processes, resulting in a die which is bonded onto a chip carrier.
Active-pixel sensorAn active-pixel sensor (APS) is an , which was invented by Peter J.W. Noble in 1968, where each pixel sensor unit cell has a photodetector (typically a pinned photodiode) and one or more active transistors. In a metal–oxide–semiconductor (MOS) active-pixel sensor, MOS field-effect transistors (MOSFETs) are used as amplifiers. There are different types of APS, including the early NMOS APS and the now much more common complementary MOS (CMOS) APS, also known as the CMOS sensor.
BrazingBrazing is a metal-joining process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal. Brazing differs from welding in that it does not involve melting the work pieces. Brazing differs from soldering through the use of a higher temperature and much more closely fitted parts than when soldering. During the brazing process, the filler metal flows into the gap between close-fitting parts by capillary action.
AccelerometerAn accelerometer is a tool that measures proper acceleration. Proper acceleration is the acceleration (the rate of change of velocity) of a body in its own instantaneous rest frame; this is different from coordinate acceleration, which is acceleration in a fixed coordinate system. For example, an accelerometer at rest on the surface of the Earth will measure an acceleration due to Earth's gravity, straight upwards (by definition) of g ≈ 9.81 m/s2. By contrast, accelerometers in free fall (falling toward the center of the Earth at a rate of about 9.
