TGVThe TGV (Train à Grande Vitesse, "high-speed train"; previously TurboTrain à Grande Vitesse) is France's intercity high-speed rail service, operated by SNCF. SNCF worked on a high-speed rail network from 1966 to 1974 and presented the project to President Georges Pompidou who approved it. Originally designed as turbotrains to be powered by gas turbines, TGV prototypes evolved into electric trains with the 1973 oil crisis. In 1976 the SNCF ordered 87 high-speed trains from Alstom.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
System in a packageA system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc.
Magnetic levitationMagnetic levitation (maglev) or magnetic suspension is a method by which an object is suspended with no support other than magnetic fields. Magnetic force is used to counteract the effects of the gravitational force and any other forces. The two primary issues involved in magnetic levitation are lifting forces: providing an upward force sufficient to counteract gravity, and stability: ensuring that the system does not spontaneously slide or flip into a configuration where the lift is neutralized.
Industrial robotAn industrial robot is a robot system used for manufacturing. Industrial robots are automated, programmable and capable of movement on three or more axes. Typical applications of robots include welding, painting, assembly, disassembly, pick and place for printed circuit boards, packaging and labeling, palletizing, product inspection, and testing; all accomplished with high endurance, speed, and precision. They can assist in material handling.
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
GlassGlass is a non-crystalline solid that is often transparent, brittle and chemically inert. It has widespread practical, technological, and decorative use in, for example, window panes, tableware, and optics. Glass is most often formed by rapid cooling (quenching) of the molten form; some glasses such as volcanic glass are naturally occurring. The most familiar, and historically the oldest, types of manufactured glass are "silicate glasses" based on the chemical compound silica (silicon dioxide, or quartz), the primary constituent of sand.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Autonomous robotAn autonomous robot is a robot that acts without recourse to human control. The first autonomous robots environment were known as Elmer and Elsie, which were constructed in the late 1940s by W. Grey Walter. They were the first robots in history that were programmed to "think" the way biological brains do and meant to have free will. Elmer and Elsie were often labeled as tortoises because of how they were shaped and the manner in which they moved. They were capable of phototaxis which is the movement that occurs in response to light stimulus.
Mobile robotA mobile robot is an automatic machine that is capable of locomotion. Mobile robotics is usually considered to be a subfield of robotics and information engineering. Mobile robots have the capability to move around in their environment and are not fixed to one physical location. Mobile robots can be "autonomous" (AMR - autonomous mobile robot) which means they are capable of navigating an uncontrolled environment without the need for physical or electro-mechanical guidance devices.
Robotic armA robotic arm is a type of mechanical arm, usually programmable, with similar functions to a human arm; the arm may be the sum total of the mechanism or may be part of a more complex robot. The links of such a manipulator are connected by joints allowing either rotational motion (such as in an articulated robot) or translational (linear) displacement. The links of the manipulator can be considered to form a kinematic chain. The terminus of the kinematic chain of the manipulator is called the end effector and it is analogous to the human hand.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
RobotA robot is a machine—especially one programmable by a computer—capable of carrying out a complex series of actions automatically. A robot can be guided by an external control device, or the control may be embedded within. Robots may be constructed to evoke human form, but most robots are task-performing machines, designed with an emphasis on stark functionality, rather than expressive aesthetics.
RoboticsRobotics is an interdisciplinary branch of electronics and communication, computer science and engineering. Robotics involves the design, construction, operation, and use of robots. The goal of robotics is to design machines that can help and assist humans. Robotics integrates fields of mechanical engineering, electrical engineering, information engineering, mechatronics engineering, electronics, biomedical engineering, computer engineering, control systems engineering, software engineering, mathematics, etc.
Magnetic bearingA magnetic bearing is a type of bearing that supports a load using magnetic levitation. Magnetic bearings support moving parts without physical contact. For instance, they are able to levitate a rotating shaft and permit relative motion with very low friction and no mechanical wear. Magnetic bearings support the highest speeds of any kind of bearing and have no maximum relative speed. Active bearings have several advantages: they do not suffer from wear, have low friction, and can often accommodate irregularities in the mass distribution automatically, allowing rotors to spin around their center of mass with very low vibration.
Package on a packagePackage on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
MEMSMEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.
Glass productionGlass production involves two main methods – the float glass process that produces sheet glass, and glassblowing that produces bottles and other containers. It has been done in a variety of ways during the history of glass. Broadly, modern glass container factories are three-part operations: the "batch house", the "hot end", and the "cold end". The batch house handles the raw materials; the hot end handles the manufacture proper—the forehearth, forming machines, and annealing ovens; and the cold end handles the product-inspection and packaging equipment.
Solder pasteSolder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe; then the components are put in place by a pick-and-place machine or by hand.
Human–robot interactionHuman–robot interaction (HRI) is the study of interactions between humans and robots. Human–robot interaction is a multidisciplinary field with contributions from human–computer interaction, artificial intelligence, robotics, natural language processing, design, and psychology. A subfield known as physical human–robot interaction (pHRI) has tended to focus on device design to enable people to safely interact with robotic systems. Human–robot interaction has been a topic of both science fiction and academic speculation even before any robots existed.
