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Publications associées (22)

Towards Scalable Electronics: Synthetic 2D Materials for Large-Area 2D Circuit Integration

Zhenyu Wang

In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...

EPFL2024

First developments towards producing inductive magnetic sensors using state-of-the-art photolithography techniques

Duccio Testa, Ambrine Douhane, Marcus Cemes

Inductive magnetic sensors are needed for tokamak operation to provide the low-frequency (LF) measurements leading to the equilibrium reconstruction and to monitor the higher frequency (HF) instabilities; the HF magnetic sensors are often also used as a ba ...

2023

Laser-Induced Forward Transfer of Functional Microdevices

Zhiwei Yang

Laser-induced forward transfer (LIFT) technique is an emerging micro additive manufacturing (AM) technique that has been widely used to print a variety of materials. Distinguished from other nozzle-based AM techniques, LIFT operates without the existence o ...

EPFL2023

High density lithium niobate photonic integrated circuits

Rui Ning Wang, Tobias Kippenberg, Mikhail Churaev, Anat Siddharth, Zelin Tan, Nikolai Kuznetsov, Zihan Li, Junyin Zhang

Photonic integrated circuits have the potential to pervade into multiple applications traditionally limited to bulk optics. Of particular interest for new applications are ferroelectrics such as Lithium Niobate, which exhibit a large Pockels effect, but ar ...

Nature Portfolio2023

Bringing casting to microfabrication: processing and deformation of microcastings

Luciano Borasi

This work extends the range of pathways for the production of metallic microcomponents by downscaling metal casting. This is accomplished by using either of two different molding techniques, namely femtosecond laser micromachining or lithographic silicon m ...

EPFL2023

High-efficiency non-ablative UV laser nano-scale processing of fused silica by stable filamentation

Yves Bellouard, Olivier Bernard, Benedikt Hermann, Luca Muscarella

Over the last decades, three-dimensional micro-manufacturing of fused silica via near-infrared ultrafast laser exposure combined with an etching step has become an established technique for producing complex three-dimensional components. Here, we explore t ...

2023

Demonstrating and Unraveling a Controlled Nanometer-Scale Expansion of the Vacancy Defects in Graphene by CO2

Kumar Varoon Agrawal, Luis Francisco Villalobos Vazquez de la Parra, Kuang-Jung Hsu

A controlled manipulation of graphene edges and vacancies is desired for molecular separation, sensing and electronics applications. Unfortunately, available etching methods always lead to vacancy nucleation making it challenging to control etching. Herein ...

Wiley-VCH Verlag GmbH2022

Investigation of femtosecond laser-enabled 3D micro-infiltration processes

Enrico Casamenti

In the last decades, the femtosecond laser micromachining of glass has attracted a lot of attention due to its three-dimensional manufacturing ability and flexibility both in terms of compatible substrates and modification types. Yet, to fully unravel its ...

EPFL2022

Controlling motion at the nanoscale with light

Mintae Chung

Optical manipulation at the micro- nano-scale is a fascinating topic due to its inherent non-invasive properties and multifaceted applications in various fields such as biology, sensing, micro-fluidics, and micro- nano-robotics. This thesis involves intens ...

EPFL2022

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications

Matthias Neuenschwander

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

EPFL2022

Precise Capillary‐Assisted Nanoparticle Assembly in Reusable Templates

Giovanni Boero, Jürgen Brugger, Olivier Martin, Henry Shao-Chi Yu, Hsiang-Chu Wang, Ana Conde Rubio

Capillary-assisted particle assembly (CAPA) in predefined topographical templates is a scalable method for the precise positioning of nanoscale objects on various surfaces. High-resolution CAPA templates are typically fabricated by expensive electron-beam ...

2022

Additive manufacturing of ceramics by two-photon lithography, volumetric 3D printing and high-resolution endo-printing

Georgia Konstantinou

Additive manufacturing is a growing sector of industrial production that allows the fabrication of parts with complex geometries and reduced waste. The context of this thesis is light-based additive manufacturing technologies. In the first part of the the ...

EPFL2022

Fabrication and applications of AuAg alloy metasurfaces and hybrid metal dielectric nanoantennas

Debdatta Ray

The most prevalent materials used in the field of plasmonics are Au and Ag. However, for the past few years, the plasmonic community has also been looking for alternative materials that have lower losses than Au and higher stability than Ag. This thesis is ...

EPFL2021

Fabrication of plasmonic structures with well-controlled nanometric features: a comparison between lift-off and ion beam etching

Christian Santschi, Olivier Martin, Banafsheh Abasahl

After providing a detailed overview of nanofabrication techniques for plasmonics, we discuss in detail two different approaches for the fabrication of metallic nanostructures based on e-beam lithography. The first approach relies on a negative e-beam resis ...

IOP PUBLISHING LTD2021

Smart Slit Assembly Employing Continuously Tunable MEMS Shutter

Benedikt Guldimann, Niels Quack, Gergely Huszka, Hamed Sattari, Anton Lagosh

We present the concept and detailed design of a Smart Slit Assembly for next generation spectrometers, and we experimentally demonstrate operation of an individual 221 mu m x 111 mu m smart slit channel employing a MEMS actuated shutter to continuously mod ...

SPIE-INT SOC OPTICAL ENGINEERING2021

FABRICATION AND ANALYSIS OF THIN FILM LITHUM NIOBATE RESONATORS FOR 5GHz FREQUENCY AND LARGE k(t)(2) APPLICATIONS

Victor Plessky, Luis Guillermo Villanueva Torrijo, Seniz Esra Küçük, Soumya Yandrapalli

This work presents the fabrication and analysis of suspended thin film Lithium Niobate resonators. The yield of the new fabrication process presented below is >90% showing devices with high k(t)(2) of 28% resonators at 5GHz, making them suitable for high f ...

IEEE2021

Systematic design of millisecond gasification reactor for the incorporation of gas-sieving nanopores in single-layer graphene

Kumar Varoon Agrawal, Shiqi Huang, Luis Francisco Villalobos Vazquez de la Parra, Shaoxian Li, Kuang-Jung Hsu

Etching an ensemble of vacancy defects (nanopores) in single-layer graphene (SLG) to obtain a high density of nanopores with an effective size that enables high-performance gas sieving is challenging. This is because nanopore nucleation and expansion are u ...

2021

Development of microdevices for the in-plane thermoelectric characterization of deposited films

Stefano Mischler

Measuring the thermoelectric transport properties of a material is a prerequisite to determining its usefulness for application in waste heat recovery or cooling and the basis for devising improvement strategies. While well-established characterization met ...

ELSEVIER2021

Mems Shutter Based Variable Optical Attenuator Integrated With Large Core Multimode Rectangular Waveguides

Benedikt Guldimann, Niels Quack, Gergely Huszka, Hamed Sattari, Anton Lagosh

We present the concept and design, and we report on the experimental performance of a broadband Variable Optical Attenuator (VOA) for integration with large-core rectangular multimode waveguides. Operation of an individual 221 mu m x 111 mu m optical waveg ...

IEEE2021

The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

Edoardo Charbon, Sandro Carrara, Simone Frasca, Rebecca Camilla Leghziel

We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturin ...

Nature Research2021

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