Publications associées à Electronic circuit simulation

Prediction of optically-triggered amplification in phototransistor with SPICE circuit simulators

Modeling of optoelectronic devices involves long and complex numerical simulations, usually performed with TCAD tools. Numerical simulations provide accurate results for a single device but are not feasible when dealing with a full circuit comprising sever ...

SPIE-INT SOC OPTICAL ENGINEERING2020

FPGA-SPICE: A Simulation-Based Architecture Evaluation Framework for FPGAs

Giovanni De Micheli, Xifan Tang, Pierre-Emmanuel Julien Marc Gaillardon, Edouard Giacomin

In this paper, we developed a simulation-based architecture evaluation framework for field-programmable gate arrays (FPGAs), called FPGA-SPICE, which enables automatic layout-level estimation and electrical simulations of FPGA architectures. FPGA-SPICE can ...

2018

Methodology for 3-D Substrate Network Extraction for SPICE Simulation of Parasitic Currents in Smart Power ICs

Maher Kayal, Jean-Michel Sallese, Camillo Stefanucci, Pietro Buccella

A 3-D simulation of substrate currents is crucial to analyze parasitic coupling effects due to minority carrier injection in smart power ICs. In this paper, a substrate parasitic extraction methodology is introduced by dividing the IC layout into elementar ...

Ieee-Inst Electrical Electronics Engineers Inc2016

Substrate Current Optimization in Smart Power ICs

Pietro Buccella

Safety requirements for modern automotive electronics call for more and more robust power integrated circuits. The mixed-signal IC design flow alone is often no longer capable of tracking possible design failures in complex Smart Power integrated circuits ...

EPFL2016

Substrate modeling of parasitic couplings in Smart Power ICs with generalized lumped devices

Camillo Stefanucci

Today automotive industry is demanding more and more compact solutions for embedded electronics to be interfaced with vehicles components such as motor drivers, igniters and car communication buses. That is why Smart Power Integrated Circuits (IC) have bee ...

EPFL2016

Modeling Minority Carriers Related Capacitive Effects for Transient Substrate Currents in Smart Power ICs

Maher Kayal, Jean-Michel Sallese, Camillo Stefanucci, Pietro Buccella

This paper presents an extended model for transient and ac circuit-level simulation of minority carriers propagation through the substrate of smart power integrated circuits (ICs). A p-n junction and a diffusion resistor with capacitive components are prop ...

Institute of Electrical and Electronics Engineers2015

Ultra Fine-Pitch TSV Technology for Ultra-Dense High-Q RF Inductors

Mihai Adrian Ionescu, Montserrat Fernandez-Bolanos Badia, Wolfgang Amadeus Vitale, Josef Weber

We demonstrate that fine-pitch TSV technology can be exploited to fabricate micro-inductors on high resistivity substrate, with record-high inductance per area and preserving their performance at GHz frequencies. We report an extensive experimental study o ...

2015

Spice-compatible modeling of high injection and propagation of minority carriers in the substrate of Smart Power ICs

Maher Kayal, Jean-Michel Sallese, Camillo Stefanucci, Pietro Buccella

Classical substrate noise analysis considers the silicon resistivity of an integrated circuit only as doping dependent besides neglecting diffusion currents as well. In power circuits minority carriers are injected into the substrate and propagate by drift ...

Elsevier2015

Biconditional Binary Decision Diagrams: A Novel Canonical Logic Representation Form

Giovanni De Micheli, Pierre-Emmanuel Julien Marc Gaillardon, Luca Gaetano Amarù

In this paper, we present biconditional binary deci- sion diagrams (BBDDs), a novel canonical representation form for Boolean functions. BBDDs are binary decision diagrams where the branching condition, and its associated logic expansion, is biconditional ...

2014

Numerical and Compact Modeling of Embedded Flash Memory Devices Targeted for IC Design

Davide Garetto

In a semiconductor market dominated by portable consumer applications, embedded flash memory technology has experienced a rapid diffusion. It is now considered the preferred solid-state memory solution for its non-volatile characteristics, high read and wr ...

EPFL2012

Efficient Modelling and Simulation Methodology for the Design of Heterogeneous Mixed-Signal Systems on Chip

Torsten Mähne

Systems on Chip (SoCs) and Systems in Package (SiPs) are key parts of a continuously broadening range of products, from chip cards and mobile phones to cars. Besides an increasing amount of digital hardware and software for data processing and storage, the ...

EPFL2011

VHDL-AMS Model of an Electrochemical Cell to Design VLSI Bio-Chips

Giovanni De Micheli, Sandro Carrara, Yusuf Leblebici, Alain Vachoux, Marialaura Beltrandi

This paper presents a new VHDL-AMS behavioral model of an electrochemical cell suitable for the design of VLSI bio-chips. Existing models are mainly equivalent circuit macromodels using electrical primitives, which hardly fit the actual behavior of biosens ...

2011

A VHDL-AMS Modeling Methodology for Top-Down/Bottom-Up Design of RF Systems

Alain Vachoux, Torsten Mähne, Matteo Contaldo

This paper presents a modelling methodology for the top-down/bottom-up design of RF systems based on systematic use of VHDL-AMS models. The model interfaces are parameterizable and pin-accurate. The designer can choose to parameterize the models using perf ...

ECSI2009

Development of a Bond Graph Based Model of Computation for SystemC-AMS

Yusuf Leblebici, Alain Vachoux, Torsten Mähne

The modelling and simulation capabilities of SystemC-AMS concerning conservative continuous time systems involving the interaction of several physical domains and with digital control components are currently limited. Bond graphs unify the description of m ...

2008

VHDL-AMS and Verilog-AMS as alternative hardware description languages for efficient modeling of multidiscipline systems

Alain Vachoux

This paper focuses on commonalities and differences between the two mixed-signal hardware description languages VHDL-AMS and Verilog-AMS in the case of modeling heterogeneous or multi-discipline systems. The paper has two objectives. The first one consists ...

2005

Modeling and Simulation of Multi-Discipline Systems using Bond Graphs and VHDL-AMS

Alain Vachoux, Christophe Lallement

Bond graphs represent a convenient tool for physical system analysis. While it is one part of the job to establish a pertinent bond graph model, it is another important part of the job to take advantage of this bond graph. A simulation tool is involved and ...

2005