Three-dimensional (3-D) integration is a promising solution to further enhance the density and performance of modern integrated circuits (ICs). In 3-D ICs, multiple dies (tiers or planes) are vertically stacked. These dies can be designed and fabricated se ...
We propose a technique to localize computation in Instruction Set Extensions (ISEs) that are clocked at very high speed with respect to the processor. In order to save power, data to and from Custom Instruction Units (CIUs) is synchronized via an optical s ...
Designing a low power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Resonant clock networks are considered efficient low-power alternatives to conventional cl ...
Designing a low power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Resonant clock networks are considered efficient low power alternatives to con- ventional ...
This paper presents a flow that is suitable to estimate energy dissipation of digital standard-cell based designs which are determined to operate in the subthreshold regime. The flow is applicable on gate-level netlists, where back-annotated toggle informa ...
Dielectric elastomer artificialmuscles have great potential for the creation of novel pumps, motors, and circuitry. Control of these devices requires an oscillator, either as a driver or clock circuit, which is typically provided as part of bulky, rigid, a ...
